Use of Plasma Information in Machine-Learning-Based Fault Detection and Classification for Advanced Equipment Control

For advanced equipment control, two schemata of real-time fault detection were performed using machine learning algorithms in silicon etching in SF 6 /O 2 /Ar plasma. Fault detection and classification is investigated with the plasma state information with optical emission spectroscopy (OES) data to...

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Bibliographic Details
Published in:IEEE transactions on semiconductor manufacturing Vol. 34; no. 3; pp. 408 - 419
Main Authors: Kim, Dong Hwan, Hong, Sang Jeen
Format: Journal Article
Language:English
Published: New York IEEE 01.08.2021
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:
ISSN:0894-6507, 1558-2345
Online Access:Get full text
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