Use of Plasma Information in Machine-Learning-Based Fault Detection and Classification for Advanced Equipment Control
For advanced equipment control, two schemata of real-time fault detection were performed using machine learning algorithms in silicon etching in SF 6 /O 2 /Ar plasma. Fault detection and classification is investigated with the plasma state information with optical emission spectroscopy (OES) data to...
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| Published in: | IEEE transactions on semiconductor manufacturing Vol. 34; no. 3; pp. 408 - 419 |
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| Main Authors: | , |
| Format: | Journal Article |
| Language: | English |
| Published: |
New York
IEEE
01.08.2021
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subjects: | |
| ISSN: | 0894-6507, 1558-2345 |
| Online Access: | Get full text |
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