Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W

[Display omitted] •A kinetic model explains and predicts residual stress evolution during deposition of sputtered and evaporated metallic thin films.•The model includes stress generation from deposition processes, grain growth and energetic particle bombardment.•The model is used to analyze six meta...

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Vydané v:	Applied surface science Ročník 613; s. 156000
Hlavní autori:	Su, Tong, Rao, Zhaoxia, Berman, Sarah, Depla, Diederik, Chason, Eric
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	Elsevier B.V 15.03.2023
Predmet:	Kinetic model Polycrystalline thin films Residual stress Sputtering deposition Polycrystalline thin films Kinetic model Sputtering deposition Residual stress
ISSN:	0169-4332
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