Su, T., Rao, Z., Berman, S., Depla, D., & Chason, E. (2023). Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W. Applied surface science, 613, 156000. https://doi.org/10.1016/j.apsusc.2022.156000
Citace podle Chicago (17th ed.)Su, Tong, Zhaoxia Rao, Sarah Berman, Diederik Depla, a Eric Chason. "Analysis of Stress in Sputter-deposited Films Using a Kinetic Model for Cu, Ni, Co, Cr, Mo, W." Applied Surface Science 613 (2023): 156000. https://doi.org/10.1016/j.apsusc.2022.156000.
Citace podle MLA (9th ed.)Su, Tong, et al. "Analysis of Stress in Sputter-deposited Films Using a Kinetic Model for Cu, Ni, Co, Cr, Mo, W." Applied Surface Science, vol. 613, 2023, p. 156000, https://doi.org/10.1016/j.apsusc.2022.156000.
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