Flexible and insulating silicone rubber composites with sandwich structure for thermal management and electromagnetic interference shielding
High integration development of electronics requires materials possessing excellent thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation. In this work, Fe2O3 particles are deposited on carbon fibers (CF) and then utilized as fillers (CF@Fe2O3) in boron nitrid...
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| Published in: | Composites science and technology Vol. 219; p. 109253 |
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| Main Authors: | , , , , , |
| Format: | Journal Article |
| Language: | English |
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Elsevier Ltd
01.03.2022
Elsevier BV |
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| ISSN: | 0266-3538, 1879-1050 |
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| Abstract | High integration development of electronics requires materials possessing excellent thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation. In this work, Fe2O3 particles are deposited on carbon fibers (CF) and then utilized as fillers (CF@Fe2O3) in boron nitride/silicone rubber (BN/SR) to fabricate sandwich structured CF@Fe2O3/(BN/SR) composites, herein, BN/SR as top & substrate layer, and CF@Fe2O3 as middle layer. Orientation of BN in CF@Fe2O3/(BN/SR) composites realizes excellent in-plane thermal conductivity coefficient (λ∥), and the core-sheath structure of CF@Fe2O3 achieves good EMI shielding performance by the “absorption-reflection (transmittance)-reabsorption” process of electromagnetic waves, insulation modification of CF and the sandwich structure strengthen the electrical insulation. When the amount of BN and CF@Fe2O3 are 20.6 wt% and 45.5 wt%, respectively, the λ∥, EMI shielding effectiveness, volume resistance and breakdown strength of CF@Fe2O3/(BN/SR) composites reach 3.86 W/(m·K), 37.7 dB, 6.2 × 1014 Ω cm and 26.8 kV/mm, respectively, which are all higher than those of commonly fabricated CF/(BN/SR) composites with same amount of BN and CF (3.83 W/(m·K), 19.4 dB, 8.6 × 1013 Ω cm and 21.4 kV/mm). CF@Fe2O3/(BN/SR) composites possess better cooling effect (5.6 °C) than that of commercial silicon grease (QM850) on the testing platform of computer's central processing unit, whose functions are more abundant and have wide application prospects in electronics.
[Display omitted]
•Designing core-sheath CF@Fe2O3 to enhance electromagnetic interference (EMI) shielding and reduce electrical conductivity of carbon fiber (CF).•Realizing orientation of boron nitride to enhance the in-plane thermal conductivity.•Silicone rubber composites possess excellent thermal conductivity, EMI shielding and insulating performances. |
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| AbstractList | High integration development of electronics requires materials possessing excellent thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation. In this work, Fe2O3 particles are deposited on carbon fibers (CF) and then utilized as fillers (CF@Fe2O3) in boron nitride/silicone rubber (BN/SR) to fabricate sandwich structured CF@Fe2O3/(BN/SR) composites, herein, BN/SR as top & substrate layer, and CF@Fe2O3 as middle layer. Orientation of BN in CF@Fe2O3/(BN/SR) composites realizes excellent in-plane thermal conductivity coefficient (λ∥), and the core-sheath structure of CF@Fe2O3 achieves good EMI shielding performance by the “absorption-reflection (transmittance)-reabsorption” process of electromagnetic waves, insulation modification of CF and the sandwich structure strengthen the electrical insulation. When the amount of BN and CF@Fe2O3 are 20.6 wt% and 45.5 wt%, respectively, the λ∥, EMI shielding effectiveness, volume resistance and breakdown strength of CF@Fe2O3/(BN/SR) composites reach 3.86 W/(m·K), 37.7 dB, 6.2 × 1014 Ω cm and 26.8 kV/mm, respectively, which are all higher than those of commonly fabricated CF/(BN/SR) composites with same amount of BN and CF (3.83 W/(m·K), 19.4 dB, 8.6 × 1013 Ω cm and 21.4 kV/mm). CF@Fe2O3/(BN/SR) composites possess better cooling effect (5.6 °C) than that of commercial silicon grease (QM850) on the testing platform of computer's central processing unit, whose functions are more abundant and have wide application prospects in electronics.
[Display omitted]
•Designing core-sheath CF@Fe2O3 to enhance electromagnetic interference (EMI) shielding and reduce electrical conductivity of carbon fiber (CF).•Realizing orientation of boron nitride to enhance the in-plane thermal conductivity.•Silicone rubber composites possess excellent thermal conductivity, EMI shielding and insulating performances. High integration development of electronics requires materials possessing excellent thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation. In this work, Fe2O3 particles are deposited on carbon fibers (CF) and then utilized as fillers ((CF@Fe2O3) in boron nitride/silicone rubber (BN/SR) to fabricate sandwich structured CF@Fe2O3/(BN/SR) composites, herein, BN/SR as top & substrate layer, and CF@Fe2O3 as middle layer. Orientation of BN in CF@Fe2O3/(BN/SR) composites realizes excellent in-plane thermal conductivity coefficient (λ∥), and the core-sheath structure of CF@Fe2O3 achieves good EMI shielding performance by the "absorption-reflection (transmittance)-reabsorption" process of electromagnetic waves, insulation modification of CF and the sandwich structure strengthen the electrical insulation. When the amount of BN and CF@Fe2O3 are 20.6 wt% and 45.5 wt%, respectively, the λ∥, EMI shielding effectiveness, volume resistance and breakdown strength of CF@Fe2O3/(BN/SR) composites reach 3.86 W/(m·K), 37.7 dB, 6.2 × 1014 Ω cm and 26.8 kV/mm, respectively, which are all higher than those of commonly fabricated CF/(BN/SR) composites with same amount of BN and CF (3.83 W/(m·K), 19.4 dB, 8.6 × 1013 Ω cm and 21.4 kV/mm). CF@Fe2O3/(BN/SR) composites possess better cooling effect (5.6 °C) than that of commercial silicon grease (QM850) on the testing platform of computer's central processing unit, whose functions are more abundant and have wide application prospects in electronics. |
| ArticleNumber | 109253 |
| Author | Guo, Yongqiang Gu, Junwei Ruan, Kunpeng Qiu, Hua Zhang, Yali Wang, Shuangshuang |
| Author_xml | – sequence: 1 givenname: Yongqiang surname: Guo fullname: Guo, Yongqiang – sequence: 2 givenname: Hua surname: Qiu fullname: Qiu, Hua email: huaqiu@nwpu.edu.cn – sequence: 3 givenname: Kunpeng surname: Ruan fullname: Ruan, Kunpeng – sequence: 4 givenname: Shuangshuang orcidid: 0000-0001-8894-6324 surname: Wang fullname: Wang, Shuangshuang – sequence: 5 givenname: Yali surname: Zhang fullname: Zhang, Yali – sequence: 6 givenname: Junwei orcidid: 0000-0002-5792-0532 surname: Gu fullname: Gu, Junwei email: gjw@nwpu.edu.cn, nwpugjw@163.com |
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| SubjectTerms | Boron Boron nitride Carbon fibers Central processing units Composite materials Cooling effects CPUs Electrical insulation Electrical resistivity Electromagnetic radiation Electromagnetic shielding Electromagnetics Electronics EMI shielding Heat conductivity Heat transfer Sandwich structures Sheaths Silicone resins Silicone rubber Silicone rubber composites Substrates Thermal conductivity Thermal management |
| Title | Flexible and insulating silicone rubber composites with sandwich structure for thermal management and electromagnetic interference shielding |
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