Development of high strength, high conductivity copper by friction stir processing

The objective of this study is to obtain a high strength, high conductivity copper by friction stir processing. Three milli meter thick pure copper plate was friction stir processed to a depth of 2.8 mm at low-heat input conditions by varying the travel speed from 50 to 250 mm/min at a constant rota...

Celý popis

Uložené v:
Podrobná bibliografia
Vydané v:Materials in engineering Ročník 32; číslo 2; s. 911 - 916
Hlavní autori: Surekha, K., Els-Botes, A.
Médium: Journal Article
Jazyk:English
Vydavateľské údaje: Elsevier Ltd 01.02.2011
Predmet:
Copper
COPPER (PURE)
ELECTRICAL CONDUCTIVITY
Electrical resistivity
Friction stir processing
Grain size
GRAIN SIZE AND SHAPE
HARDNESS
High strength
Measuring instruments
Microhardness
TENSILE STRENGTH
YIELD STRENGTH
ISSN:0261-3069
On-line prístup:Získať plný text
Tagy: Pridať tag
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
Popis
Shrnutí:The objective of this study is to obtain a high strength, high conductivity copper by friction stir processing. Three milli meter thick pure copper plate was friction stir processed to a depth of 2.8 mm at low-heat input conditions by varying the travel speed from 50 to 250 mm/min at a constant rotation speed (300 rpm) to obtain fine grains. Grain size of the nugget decreased from 9 to 3 μm and the hardness increased from 102 to 114 H V by increasing the traverse speed from 50 to 250 mm/min. Yield strength, microhardness and ultimate tensile strength increased with decrease in grain size in the nugget region and the yield strength obeyed σ s = 223.8 + 0.07 d −1/2 Hall–Petch relationship, where d is the grain size in m. Electrical resistivity measurement at room temperature showed that there was no change in the resistivity of the processed samples compared to the base metal.
Bibliografia:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0261-3069
DOI:10.1016/j.matdes.2010.08.028