Thermal Model Identification of Computing Nodes in High-Performance Computing Systems
Thermal-aware design and online optimization of the cooling effort are becoming increasingly important in current and future high-performance computing (HPC) systems. A fundamental requirement to effectively develop such techniques is the availability of distributed and compact models representing t...
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| Published in: | IEEE transactions on industrial electronics (1982) Vol. 67; no. 9; pp. 7778 - 7788 |
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| Main Authors: | , , |
| Format: | Journal Article |
| Language: | English |
| Published: |
New York
IEEE
01.09.2020
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subjects: | |
| ISSN: | 0278-0046, 1557-9948 |
| Online Access: | Get full text |
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