Shen, S., Clerckx, B., & Murch, R. (2022). Modeling and Architecture Design of Reconfigurable Intelligent Surfaces Using Scattering Parameter Network Analysis. IEEE transactions on wireless communications, 21(2), 1229-1243. https://doi.org/10.1109/TWC.2021.3103256
Chicago-Zitierstil (17. Ausg.)Shen, Shanpu, Bruno Clerckx, und Ross Murch. "Modeling and Architecture Design of Reconfigurable Intelligent Surfaces Using Scattering Parameter Network Analysis." IEEE Transactions on Wireless Communications 21, no. 2 (2022): 1229-1243. https://doi.org/10.1109/TWC.2021.3103256.
MLA-Zitierstil (9. Ausg.)Shen, Shanpu, et al. "Modeling and Architecture Design of Reconfigurable Intelligent Surfaces Using Scattering Parameter Network Analysis." IEEE Transactions on Wireless Communications, vol. 21, no. 2, 2022, pp. 1229-1243, https://doi.org/10.1109/TWC.2021.3103256.