Shen, S., Clerckx, B., & Murch, R. (2022). Modeling and Architecture Design of Reconfigurable Intelligent Surfaces Using Scattering Parameter Network Analysis. IEEE transactions on wireless communications, 21(2), 1229-1243. https://doi.org/10.1109/TWC.2021.3103256
Citace podle Chicago (17th ed.)Shen, Shanpu, Bruno Clerckx, a Ross Murch. "Modeling and Architecture Design of Reconfigurable Intelligent Surfaces Using Scattering Parameter Network Analysis." IEEE Transactions on Wireless Communications 21, no. 2 (2022): 1229-1243. https://doi.org/10.1109/TWC.2021.3103256.
Citace podle MLA (9th ed.)Shen, Shanpu, et al. "Modeling and Architecture Design of Reconfigurable Intelligent Surfaces Using Scattering Parameter Network Analysis." IEEE Transactions on Wireless Communications, vol. 21, no. 2, 2022, pp. 1229-1243, https://doi.org/10.1109/TWC.2021.3103256.