Efficient Approximation Algorithms for Chemical Mechanical Polishing Dummy Fill

To reduce chip-scale topography variation in chemical mechanical polishing process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the density-driven dummy fill problem as a standard linear program (LP). However, solving the huge linear program for...

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Vydáno v:	IEEE transactions on computer-aided design of integrated circuits and systems Ročník 30; číslo 3; s. 402 - 415
Hlavní autoři:	Feng, Chunyang, Zhou, Hai, Yan, Changhao, Tao, Jun, Zeng, Xuan
Médium:	Journal Article
Jazyk:	angličtina
Vydáno:	New York IEEE 01.03.2011 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Témata:	Algorithm design and analysis Algorithms Approximation Approximation algorithms Approximation methods Capacitance Coupling capacitance Couplings covering linear programming Design engineering design for manufacturability Dummies dummy fill problem Heuristic Joining Layout Mathematical analysis Monte Carlo methods Operations research Upper bound
ISSN:	0278-0070, 1937-4151
On-line přístup:	Získat plný text
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