Wang, S., Yang, H., Gao, C., & Chen, Z. (2020). In-plane stress analysis of two nanoscale holes under surface tension. Archive of applied mechanics (1991), 90(6), 1363-1372. https://doi.org/10.1007/s00419-020-01672-9
Citácia podle Chicago (17th ed.)Wang, Shuang, Hai-Bing Yang, Cunfa Gao, a Zengtao Chen. "In-plane Stress Analysis of Two Nanoscale Holes Under Surface Tension." Archive of Applied Mechanics (1991) 90, no. 6 (2020): 1363-1372. https://doi.org/10.1007/s00419-020-01672-9.
Citácia podľa MLA (8th ed.)Wang, Shuang, et al. "In-plane Stress Analysis of Two Nanoscale Holes Under Surface Tension." Archive of Applied Mechanics (1991), vol. 90, no. 6, 2020, pp. 1363-1372, https://doi.org/10.1007/s00419-020-01672-9.
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