Modeling of Doped Fully Depleted Behavior Induced by Total Ionizing Dose in Voltage Reference Circuits From a 65-nm Partially Depleted SOI Technology
In this article, a doped fully depleted silicon on insulator (FDSOI) behavior for the 65-nm partially depleted silicon on insulator (PDSOI) technology is demonstrated to understand the output voltage shift of a voltage reference (VR) undergoing dose deposition in real time. From an in-depth top-bott...
Uložené v:
| Vydané v: | IEEE transactions on nuclear science Ročník 72; číslo 4; s. 1276 - 1284 |
|---|---|
| Hlavní autori: | , , , , , , |
| Médium: | Journal Article |
| Jazyk: | English |
| Vydavateľské údaje: |
New York
IEEE
01.04.2025
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Predmet: | |
| ISSN: | 0018-9499, 1558-1578 |
| On-line prístup: | Získať plný text |
| Tagy: |
Pridať tag
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
|
| Abstract | In this article, a doped fully depleted silicon on insulator (FDSOI) behavior for the 65-nm partially depleted silicon on insulator (PDSOI) technology is demonstrated to understand the output voltage shift of a voltage reference (VR) undergoing dose deposition in real time. From an in-depth top-bottom analysis, including both experiments and technology computer aided design (TCAD)/simulation program with integrated circuit emphasis (SPICE) simulations, we highlighted this unexpected doped FDSOI behavior. This study shows how it worsens the total ionizing dose (TID) effects due to the coupling effect between the front and back interfaces, not usual in this technology. A new threshold voltage model considering channel doping and TID is developed, showing how doping concentration is an important hardening parameter. This model is reused, in a multiscale approach, to reproduce the output voltage shift of a VR based on the PDSOI transistor degradation. |
|---|---|
| AbstractList | In this article, a doped fully depleted silicon on insulator (FDSOI) behavior for the 65-nm partially depleted silicon on insulator (PDSOI) technology is demonstrated to understand the output voltage shift of a voltage reference (VR) undergoing dose deposition in real time. From an in-depth top-bottom analysis, including both experiments and technology computer aided design (TCAD)/simulation program with integrated circuit emphasis (SPICE) simulations, we highlighted this unexpected doped FDSOI behavior. This study shows how it worsens the total ionizing dose (TID) effects due to the coupling effect between the front and back interfaces, not usual in this technology. A new threshold voltage model considering channel doping and TID is developed, showing how doping concentration is an important hardening parameter. This model is reused, in a multiscale approach, to reproduce the output voltage shift of a VR based on the PDSOI transistor degradation. |
| Author | Martinie, S. Bournel, A. Charbonnier, G. Marcandella, C. Lomonaco, J. Rostand, N. Bedecarrats, T. |
| Author_xml | – sequence: 1 givenname: J. orcidid: 0009-0003-7542-8677 surname: Lomonaco fullname: Lomonaco, J. email: julien.lomonaco@cea.fr organization: CEA, DAM, DIF, Arpajon, France – sequence: 2 givenname: N. orcidid: 0000-0002-2335-5416 surname: Rostand fullname: Rostand, N. organization: CEA, DAM, DIF, Arpajon, France – sequence: 3 givenname: S. surname: Martinie fullname: Martinie, S. organization: CEA-LETI, Université Grenoble Alpes, Grenoble, France – sequence: 4 givenname: G. surname: Charbonnier fullname: Charbonnier, G. organization: CEA, DAM, DIF, Arpajon, France – sequence: 5 givenname: C. surname: Marcandella fullname: Marcandella, C. organization: CEA, DAM, DIF, Arpajon, France – sequence: 6 givenname: T. surname: Bedecarrats fullname: Bedecarrats, T. organization: CEA-LETI, Université Grenoble Alpes, Grenoble, France – sequence: 7 givenname: A. surname: Bournel fullname: Bournel, A. organization: CNRS, Centre de Nanosciences et de Nanotechnologies, Université Paris-Saclay, Palaiseau, France |
| BookMark | eNpVkEtPwzAQhC1UJFrgzoGDJc4pfsSJfYSWQqXyEBSukXE2ravULk6CVP4H_xdX5QCn3VnN7EjfAPWcd4DQGSVDSom6nD-8DBlhYsgFp5nMD1CfCiETKnLZQ31CqExUqtQRGjTNKspUENFH3_e-hNq6BfYVHvsNlHjS1fUWj2FTQxvlNSz1p_UBT13ZmXh43-K5b3WNp97Zr1107BvA1uE3X7d6AfgZKgjgDOCRDaazbYMnwa-xxplI3Bo_6dBa_a_l5XGK52CWztd-sT1Bh5WuGzj9ncfodXIzH90ls8fb6ehqlhhO8zappDJMS2GkJJxVtJRE5DStFABlJcSFsTJ7h9RAxg01MgfGjVDRqQxlhh-ji_3fTfAfHTRtsfJdcLGy4FRxKdJM0Ogie5cJvmkCVMUm2LUO24KSYge_iPCLHfziF36MnO8jFgD-2GUqJGH8B-pbgsI |
| CODEN | IETNAE |
| Cites_doi | 10.1016/j.sse.2023.108813 10.1007/978-1-4419-9106-5 10.1016/j.sse.2019.05.005 10.1109/TNS.2023.3337288 10.1109/TNS.2013.2249095 10.1109/TNS.2014.2367512 10.1109/TED.2024.3363110 10.1109/TNS.2023.3252439 10.1016/j.microrel.2016.11.007 10.1016/j.sse.2018.08.011 10.1016/j.microrel.2023.115273 10.1109/TNS.2003.812927 10.1109/IEDM.2013.6724728 10.1109/TNS.2018.2828142 10.1109/TED.2015.2458339 10.1109/t-ed.1983.21282 10.1109/TCSI.2009.2028411 10.1016/j.microrel.2018.03.014 10.1109/TNS.2010.2104162 10.1109/TNS.2019.2911429 10.1109/TNS.2002.805387 10.1109/TNS.2003.812928 10.1007/978-90-481-8614-3 |
| ContentType | Journal Article |
| Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2025 |
| Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2025 |
| DBID | 97E RIA RIE AAYXX CITATION 7QF 7QL 7QQ 7SC 7SE 7SP 7SR 7T7 7TA 7TB 7U5 7U9 8BQ 8FD C1K F28 FR3 H8D H94 JG9 JQ2 KR7 L7M L~C L~D M7N P64 |
| DOI | 10.1109/TNS.2025.3531687 |
| DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef Aluminium Industry Abstracts Bacteriology Abstracts (Microbiology B) Ceramic Abstracts Computer and Information Systems Abstracts Corrosion Abstracts Electronics & Communications Abstracts Engineered Materials Abstracts Industrial and Applied Microbiology Abstracts (Microbiology A) Materials Business File Mechanical & Transportation Engineering Abstracts Solid State and Superconductivity Abstracts Virology and AIDS Abstracts METADEX Technology Research Database Environmental Sciences and Pollution Management ANTE: Abstracts in New Technology & Engineering Engineering Research Database Aerospace Database AIDS and Cancer Research Abstracts Materials Research Database ProQuest Computer Science Collection Civil Engineering Abstracts Advanced Technologies Database with Aerospace Computer and Information Systems Abstracts Academic Computer and Information Systems Abstracts Professional Algology Mycology and Protozoology Abstracts (Microbiology C) Biotechnology and BioEngineering Abstracts |
| DatabaseTitle | CrossRef Materials Research Database Technology Research Database Computer and Information Systems Abstracts – Academic Mechanical & Transportation Engineering Abstracts ProQuest Computer Science Collection Computer and Information Systems Abstracts Materials Business File Environmental Sciences and Pollution Management Aerospace Database Engineered Materials Abstracts Bacteriology Abstracts (Microbiology B) Algology Mycology and Protozoology Abstracts (Microbiology C) AIDS and Cancer Research Abstracts Industrial and Applied Microbiology Abstracts (Microbiology A) Advanced Technologies Database with Aerospace ANTE: Abstracts in New Technology & Engineering Civil Engineering Abstracts Aluminium Industry Abstracts Virology and AIDS Abstracts Electronics & Communications Abstracts Ceramic Abstracts METADEX Biotechnology and BioEngineering Abstracts Computer and Information Systems Abstracts Professional Solid State and Superconductivity Abstracts Engineering Research Database Corrosion Abstracts |
| DatabaseTitleList | Materials Research Database |
| Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://ieeexplore.ieee.org/ sourceTypes: Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 1558-1578 |
| EndPage | 1284 |
| ExternalDocumentID | 10_1109_TNS_2025_3531687 10845802 |
| Genre | orig-research |
| GroupedDBID | .DC .GJ 0R~ 29I 3O- 4.4 53G 5GY 5RE 5VS 6IK 8WZ 97E A6W AAJGR AARMG AASAJ AAWTH ABAZT ABQJQ ABVLG ACGFO ACGFS ACIWK ACNCT ACPRK AENEX AETEA AETIX AFRAH AGQYO AGSQL AHBIQ AI. AIBXA AKJIK AKQYR ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD F5P HZ~ H~9 IAAWW IBMZZ ICLAB IDIHD IFIPE IFJZH IPLJI JAVBF LAI M43 MS~ O9- OCL P2P RIA RIE RNS TAE TN5 VH1 VOH AAYXX CITATION 7QF 7QL 7QQ 7SC 7SE 7SP 7SR 7T7 7TA 7TB 7U5 7U9 8BQ 8FD C1K F28 FR3 H8D H94 JG9 JQ2 KR7 L7M L~C L~D M7N P64 |
| ID | FETCH-LOGICAL-c317t-f89c2a85c88032f1d805714f9ee12de4f922d6be4ce63c1c87e23c59f1d9c12c3 |
| IEDL.DBID | RIE |
| ISICitedReferencesCount | 0 |
| ISICitedReferencesURI | http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=001473241800038&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D |
| ISSN | 0018-9499 |
| IngestDate | Mon Jun 30 10:17:12 EDT 2025 Mon Nov 24 03:35:28 EST 2025 Wed Aug 27 02:04:02 EDT 2025 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 4 |
| Language | English |
| License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html https://doi.org/10.15223/policy-029 https://doi.org/10.15223/policy-037 |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c317t-f89c2a85c88032f1d805714f9ee12de4f922d6be4ce63c1c87e23c59f1d9c12c3 |
| Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
| ORCID | 0000-0002-2335-5416 0009-0003-7542-8677 |
| PQID | 3193854651 |
| PQPubID | 85457 |
| PageCount | 9 |
| ParticipantIDs | crossref_primary_10_1109_TNS_2025_3531687 proquest_journals_3193854651 ieee_primary_10845802 |
| PublicationCentury | 2000 |
| PublicationDate | 2025-04-01 |
| PublicationDateYYYYMMDD | 2025-04-01 |
| PublicationDate_xml | – month: 04 year: 2025 text: 2025-04-01 day: 01 |
| PublicationDecade | 2020 |
| PublicationPlace | New York |
| PublicationPlace_xml | – name: New York |
| PublicationTitle | IEEE transactions on nuclear science |
| PublicationTitleAbbrev | TNS |
| PublicationYear | 2025 |
| Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| References | ref13 ref15 ref11 ref10 ref2 ref1 ref17 ref19 Leray (ref26) ref18 Adell (ref14) Sze (ref21) 2007 ref24 ref23 ref25 ref20 ref22 ref28 ref27 ref8 ref7 ref9 ref4 ref3 ref6 Bazizi (ref16) ref5 (ref12) 2014 |
| References_xml | – ident: ref17 doi: 10.1016/j.sse.2023.108813 – start-page: 37 volume-title: Proc. IEEE NSREC Short Course ident: ref14 article-title: Dose and dose rate effects in microelectronics: Pushing the limits to extreme conditions – ident: ref11 doi: 10.1007/978-1-4419-9106-5 – ident: ref18 doi: 10.1016/j.sse.2019.05.005 – ident: ref5 doi: 10.1109/TNS.2023.3337288 – ident: ref10 doi: 10.1109/TNS.2013.2249095 – ident: ref27 doi: 10.1109/TNS.2014.2367512 – ident: ref19 doi: 10.1109/TED.2024.3363110 – ident: ref9 doi: 10.1109/TNS.2023.3252439 – ident: ref28 doi: 10.1016/j.microrel.2016.11.007 – ident: ref23 doi: 10.1016/j.sse.2018.08.011 – ident: ref2 doi: 10.1016/j.microrel.2023.115273 – ident: ref1 doi: 10.1109/TNS.2003.812927 – ident: ref6 doi: 10.1109/IEDM.2013.6724728 – ident: ref15 doi: 10.1109/TNS.2018.2828142 – ident: ref22 doi: 10.1109/TED.2015.2458339 – volume-title: Physics of Semiconductor Devices year: 2007 ident: ref21 – ident: ref20 doi: 10.1109/t-ed.1983.21282 – ident: ref4 doi: 10.1109/TCSI.2009.2028411 – start-page: 292 volume-title: Proc. ESSDERC ident: ref16 article-title: Comparison between 65 nm bulk and PDSOI MOSFETs: Si/BOX interface effect on point defects and doping profiles – ident: ref8 doi: 10.1016/j.microrel.2018.03.014 – volume-title: TCAD Sentaurus Device Manual year: 2014 ident: ref12 – ident: ref7 doi: 10.1109/TNS.2010.2104162 – ident: ref25 doi: 10.1109/TNS.2019.2911429 – volume-title: IEEE NSREC Short Course ident: ref26 article-title: Total dose effects: Modeling for present and future – ident: ref13 doi: 10.1109/TNS.2002.805387 – ident: ref3 doi: 10.1109/TNS.2003.812928 – ident: ref24 doi: 10.1007/978-90-481-8614-3 |
| SSID | ssj0014505 |
| Score | 2.4447465 |
| Snippet | In this article, a doped fully depleted silicon on insulator (FDSOI) behavior for the 65-nm partially depleted silicon on insulator (PDSOI) technology is... |
| SourceID | proquest crossref ieee |
| SourceType | Aggregation Database Index Database Publisher |
| StartPage | 1276 |
| SubjectTerms | CAD Circuits Computer aided design Degradation Depletion Doping Fully depleted silicon on insulator (FDSOI) Integrated circuit modeling Integrated circuits modeling Multiscale analysis partially depleted silicon on insulator (PDSOI) Photonic band gap Predictive models radiation experiments Semiconductor process modeling Silicon Silicon-on-insulator simulation program with integrated circuit emphasis (SPICE) simulation SOI (semiconductors) technology computer aided design (TCAD) Threshold voltage Total ionizing dose total ionizing dose (TID) Transistors Voltage voltage reference (VR) |
| Title | Modeling of Doped Fully Depleted Behavior Induced by Total Ionizing Dose in Voltage Reference Circuits From a 65-nm Partially Depleted SOI Technology |
| URI | https://ieeexplore.ieee.org/document/10845802 https://www.proquest.com/docview/3193854651 |
| Volume | 72 |
| WOSCitedRecordID | wos001473241800038&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| journalDatabaseRights | – providerCode: PRVIEE databaseName: IEEE Electronic Library (IEL) customDbUrl: eissn: 1558-1578 dateEnd: 99991231 omitProxy: false ssIdentifier: ssj0014505 issn: 0018-9499 databaseCode: RIE dateStart: 19630101 isFulltext: true titleUrlDefault: https://ieeexplore.ieee.org/ providerName: IEEE |
| link | http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LT-MwELYAcdg98F5RXpoDFw5hm9hJ7COiVHApSBTELUomE6nSklRpigT_g__L2El5aMWBmxPZiaXPM57xeOYT4lj10c9jkp4fIXnKqMgzeeh7iMjbkSwKI9GRTcSjkX54MDddsrrLhSEid_mMTm3TxfLzCuf2qIwlXKtQ29KRy3Ectcla7yEDFfY7ugKWYLbjFzHJvvk7Ht2yJxiEpzK0PE3xlz3Ikar8p4nd9jJc_-HENsRaZ0fCWQv8pliickv8_lRdcFu8Wp4zm20OVQGDako5WIfzGQY0ZbT4sSuOWIMl8EB-kT3DuGJzHK5Y1F_s0EE1I5iUcF_9a1j1wHthWjif1DifNDMY1tUjpBCFXvkIN3Yppl_-cnt9BR8n-DvibngxPr_0OhYGD9m2aLxCGwxSHSJLugwKP9ds4vmqMER-kBM3giCPMlJIkUQfdUyBxNBwT4N-gPKPWCmrknYFZBjpVKaGnTipyGAWoZYqk6mtYaPToidOFrgk07bYRuKclL5JGMPEYph0GPbEjsXhU78Wgp44WCCZdOI4S1jPSO1o3_e-GbYvftmvt3dyDsRKU8_pUKziUzOZ1Udupb0Be8DR2Q |
| linkProvider | IEEE |
| linkToHtml | http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1Lb9QwELZQQYIeeBZ1oYU5cOGQkviRtY-oy6orylKpC-otSiYTaSWarLJZpPI_-L-MnWxphTj0Zke2HOnzjGc8nvmEeKdjTMoxqShJkSLtdBq50iQRIvJxpKrKKQxkE-P53F5cuLMhWT3kwhBReHxGR74ZYvllgxt_VcYSbrWxvnTkfaO1jPt0reuggTbxQFjAMsyW_DYqGbsPi_k5-4LSHCnjmZrGt06hQKvyjy4OB8z0yR1_7al4PFiS8LGH_pm4R_VzsXujvuAL8dsznfl8c2gqmDQrKsG7nFcwoRXjxd2hPGILnsID-UNxBYuGDXKYsbD_8lMnzZpgWcP35kfHygeuS9PC8bLFzbJbw7RtLiGH1ET1JZz5zZjfWuX86wz-3uHviW_TT4vjk2jgYYiQrYsuqqxDmVuDLOtKVklp2chLdOWIElkSN6Qs04I0UqowQTsmqdA4Hukwkaheip26qWlfQIGpzVXu2I1TmhwWKVqlC5X7KjY2r0bi_RaXbNWX28iCmxK7jDHMPIbZgOFI7HkcbozrIRiJgy2S2SCQ64w1jbKB-P3Vf6a9FQ9PFl9Os9PZ_PNr8civ1L_QORA7XbuhQ_EAf3bLdfsm7Lo_ja3VIA |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Modeling+of+Doped+Fully+Depleted+Behavior+Induced+by+Total+Ionizing+Dose+in+Voltage+Reference+Circuits+From+a+65-nm+Partially+Depleted+SOI+Technology&rft.jtitle=IEEE+transactions+on+nuclear+science&rft.au=Lomonaco%2C+J.&rft.au=Rostand%2C+N.&rft.au=Martinie%2C+S.&rft.au=Charbonnier%2C+G.&rft.date=2025-04-01&rft.pub=IEEE&rft.issn=0018-9499&rft.volume=72&rft.issue=4&rft.spage=1276&rft.epage=1284&rft_id=info:doi/10.1109%2FTNS.2025.3531687&rft.externalDocID=10845802 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0018-9499&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0018-9499&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0018-9499&client=summon |