Hou, T., Su, C., & Chang, H. (2008). An integrated multi-objective immune algorithm for optimizing the wire bonding process of integrated circuits. Journal of intelligent manufacturing, 19(3), 361-374. https://doi.org/10.1007/s10845-008-0088-2
Chicago-Zitierstil (17. Ausg.)Hou, Tung-Hsu, Chi-Hung Su, und Hung-Zhi Chang. "An Integrated Multi-objective Immune Algorithm for Optimizing the Wire Bonding Process of Integrated Circuits." Journal of Intelligent Manufacturing 19, no. 3 (2008): 361-374. https://doi.org/10.1007/s10845-008-0088-2.
MLA-Zitierstil (9. Ausg.)Hou, Tung-Hsu, et al. "An Integrated Multi-objective Immune Algorithm for Optimizing the Wire Bonding Process of Integrated Circuits." Journal of Intelligent Manufacturing, vol. 19, no. 3, 2008, pp. 361-374, https://doi.org/10.1007/s10845-008-0088-2.