A study of the lead-free hot air solder levelling process

Purpose - The traditional surface finish for bare boards, eutectic tin-lead solder from the HASL process, is well characterized, but very little is known about the implementation of lead free solder in that application. This paper will present the results of a study that defined process parameters f...

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Veröffentlicht in:	Circuit world Jg. 31; H. 2; S. 3 - 9
1. Verfasser:	Fellman, Jack
Format:	Journal Article
Sprache:	Englisch
Veröffentlicht:	Bradford Emerald Group Publishing Limited 01.06.2005
Schlagworte:	Alloys Copper Electronics contamination High temperature Laminates Lead content Lead free solders Polymers Printed circuit boards Production methods Statistical analysis Studies Surface mount technology Solder Printed-circuit boards Surface treatment
ISSN:	0305-6120, 1758-602X, 0305-6120
Online-Zugang:	Volltext
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