Fellman, J. (2005). A study of the lead-free hot air solder levelling process. Circuit world, 31(2), 3-9. https://doi.org/10.1108/03056120510571789
Citace podle Chicago (17th ed.)Fellman, Jack. "A Study of the Lead-free Hot Air Solder Levelling Process." Circuit World 31, no. 2 (2005): 3-9. https://doi.org/10.1108/03056120510571789.
Citace podle MLA (9th ed.)Fellman, Jack. "A Study of the Lead-free Hot Air Solder Levelling Process." Circuit World, vol. 31, no. 2, 2005, pp. 3-9, https://doi.org/10.1108/03056120510571789.
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