Multi-Objective optimization of electroplating parameters for low-passive intermodulation radio frequency connectors
•We propose a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors.•We investigate the effects of electroplating process parameters on connector PIM.•We establish an electroplating parameter optimizat...
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| Published in: | Results in engineering Vol. 28; p. 107509 |
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01.12.2025
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| Abstract | •We propose a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors.•We investigate the effects of electroplating process parameters on connector PIM.•We establish an electroplating parameter optimization model that successfully obtains low-PIM connector configurations through multi-objective analysis.
This paper proposes a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors. Firstly, the surface morphology of the connector was quantified by fractal theory, and the influence of electroplating parameters on the coating thickness and the fractal parameters of the coating surface was revealed by electroplating simulation. Secondly, the established RF connector coating was analyzed, including the surface microstates, equivalent circuit model, impedance and other electrical parameters were investigated to obtain the relationship between the RF connector PIM and the surface topography parameters of RF connector coating. Finally, by integrating a BP neural network with the NSGA-II algorithm to achieve multi-objective optimization of plating parameters, the optimal combination of plating parameters for low PIM connectors under various operating conditions was obtained. The results show that the electroplating parameters have regulatory properties on connector PIM, and through this multi-objective optimization method, the connector coating can be adjusted to achieve connector low-PIM. |
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| AbstractList | •We propose a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors.•We investigate the effects of electroplating process parameters on connector PIM.•We establish an electroplating parameter optimization model that successfully obtains low-PIM connector configurations through multi-objective analysis.
This paper proposes a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors. Firstly, the surface morphology of the connector was quantified by fractal theory, and the influence of electroplating parameters on the coating thickness and the fractal parameters of the coating surface was revealed by electroplating simulation. Secondly, the established RF connector coating was analyzed, including the surface microstates, equivalent circuit model, impedance and other electrical parameters were investigated to obtain the relationship between the RF connector PIM and the surface topography parameters of RF connector coating. Finally, by integrating a BP neural network with the NSGA-II algorithm to achieve multi-objective optimization of plating parameters, the optimal combination of plating parameters for low PIM connectors under various operating conditions was obtained. The results show that the electroplating parameters have regulatory properties on connector PIM, and through this multi-objective optimization method, the connector coating can be adjusted to achieve connector low-PIM. |
| ArticleNumber | 107509 |
| Author | Lang, Yingyi Ning, Yuming Dong, Hangjia He, Xinyu Huang, Yongxiang Li, Tuanjie |
| Author_xml | – sequence: 1 givenname: Yongxiang surname: Huang fullname: Huang, Yongxiang organization: State Key Laboratory of Electromecha-nical Integrated Manufacturing of High-performance Electronic Equipme-nts, Xidian University, Xi'an 710071, China – sequence: 2 givenname: Tuanjie orcidid: 0000-0002-5426-8120 surname: Li fullname: Li, Tuanjie email: tjli888@126.com organization: State Key Laboratory of Electromecha-nical Integrated Manufacturing of High-performance Electronic Equipme-nts, Xidian University, Xi'an 710071, China – sequence: 3 givenname: Xinyu surname: He fullname: He, Xinyu organization: State Key Laboratory of Electromecha-nical Integrated Manufacturing of High-performance Electronic Equipme-nts, Xidian University, Xi'an 710071, China – sequence: 4 givenname: Yingyi surname: Lang fullname: Lang, Yingyi organization: State Key Laboratory of Electromecha-nical Integrated Manufacturing of High-performance Electronic Equipme-nts, Xidian University, Xi'an 710071, China – sequence: 5 givenname: Yuming surname: Ning fullname: Ning, Yuming organization: State Key Laboratory of Electromecha-nical Integrated Manufacturing of High-performance Electronic Equipme-nts, Xidian University, Xi'an 710071, China – sequence: 6 givenname: Hangjia surname: Dong fullname: Dong, Hangjia organization: State Key Laboratory of Electromecha-nical Integrated Manufacturing of High-performance Electronic Equipme-nts, Xidian University, Xi'an 710071, China |
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| Cites_doi | 10.1109/LMWC.2018.2865506 10.1098/rspa.1985.0083 10.1109/TMTT.2018.2838147 10.1109/TCPMT.2023.3304323 10.1002/mmce.21716 10.1109/TMTT.2007.895400 10.1109/LMWT.2024.3381953 10.1109/TMTT.2007.912166 10.23919/EuCAP.2017.7928675 10.3390/electronicmat3010007 10.1109/TEMC.2018.2809449 10.1007/s10825-017-1092-6 10.1109/NRSC.1996.551127 10.1016/j.cja.2014.03.003 10.1109/TEMC.2017.2725278 10.1109/TEMC.2018.2794992 10.1109/TMTT.2024.3363885 10.1109/LMWC.2009.2029733 10.1063/1.1592628 10.1109/TIM.2022.3220285 10.1115/1.2920588 10.1017/S175907871900093X 10.1109/TIM.1990.1032896 |
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| Keywords | Fractal theory Electroplating parameters BP network Multi-objective optimization method Low-PIM |
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| Title | Multi-Objective optimization of electroplating parameters for low-passive intermodulation radio frequency connectors |
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