Wan, T., Shao, B., Ma, S., Zhou, Y., Li, Q., & Chai, Y. (2023). In‐Sensor Computing: Materials, Devices, and Integration Technologies. Advanced materials (Weinheim), 35(37), e2203830. https://doi.org/10.1002/adma.202203830
Citácia podle Chicago (17th ed.)Wan, Tianqing, Bangjie Shao, Sijie Ma, Yue Zhou, Qiao Li, a Yang Chai. "In‐Sensor Computing: Materials, Devices, and Integration Technologies." Advanced Materials (Weinheim) 35, no. 37 (2023): e2203830. https://doi.org/10.1002/adma.202203830.
Citácia podľa MLA (8th ed.)Wan, Tianqing, et al. "In‐Sensor Computing: Materials, Devices, and Integration Technologies." Advanced Materials (Weinheim), vol. 35, no. 37, 2023, p. e2203830, https://doi.org/10.1002/adma.202203830.
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