APA (7th ed.) Citation

Wan, T., Shao, B., Ma, S., Zhou, Y., Li, Q., & Chai, Y. (2023). In‐Sensor Computing: Materials, Devices, and Integration Technologies. Advanced materials (Weinheim), 35(37), e2203830. https://doi.org/10.1002/adma.202203830

Chicago Style (17th ed.) Citation

Wan, Tianqing, Bangjie Shao, Sijie Ma, Yue Zhou, Qiao Li, and Yang Chai. "In‐Sensor Computing: Materials, Devices, and Integration Technologies." Advanced Materials (Weinheim) 35, no. 37 (2023): e2203830. https://doi.org/10.1002/adma.202203830.

MLA (9th ed.) Citation

Wan, Tianqing, et al. "In‐Sensor Computing: Materials, Devices, and Integration Technologies." Advanced Materials (Weinheim), vol. 35, no. 37, 2023, p. e2203830, https://doi.org/10.1002/adma.202203830.