Electromagnetic-Circuital-Thermal-Mechanical Multiphysics Numerical Simulation Method for Microwave Circuits

A electromagnetic-circuital-thermal-mechanical mu- ltiphysics numerical method is proposed for the simulation of microwave circuits. The discontinuous Galerkin time-domain (DGTD) method is adopted for electromagnetic simulation. The time-domain finite element method (FEM) is utilized for thermal sim...

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Veröffentlicht in:IEEE journal on multiscale and multiphysics computational techniques Jg. 9; S. 129 - 141
Hauptverfasser: Zhang, Huan Huan, Jia, Zheng Lang, Zhang, Peng Fei, Liu, Ying, Jiang, Li Jun, Ding, Da Zhi
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Piscataway IEEE 2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN:2379-8815, 2379-8815
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Abstract A electromagnetic-circuital-thermal-mechanical mu- ltiphysics numerical method is proposed for the simulation of microwave circuits. The discontinuous Galerkin time-domain (DGTD) method is adopted for electromagnetic simulation. The time-domain finite element method (FEM) is utilized for thermal simulation. The circuit equation is applied for circuit simulation. The mechanical simulation is also carried out by FEM method. A flexible and unified multiphysics field coupling mechanism is constructed to cover various electromagnetic, circuital, thermal and mechanical multiphysics coupling scenarios. Finally, three numerical examples emulating outer space environment, intense electromagnetic pulse (EMP) injection and high power microwave (HPM) illumination are utilized to demonstrate the accuracy, efficiency, and capability of the proposed method. The proposed method provides a versatile and powerful tool for the design and analysis of microwave circuits characterized by intertwined electromagnetic, circuital, thermal and stress behaviors.
AbstractList A electromagnetic-circuital-thermal-mechanical mu- ltiphysics numerical method is proposed for the simulation of microwave circuits. The discontinuous Galerkin time-domain (DGTD) method is adopted for electromagnetic simulation. The time-domain finite element method (FEM) is utilized for thermal simulation. The circuit equation is applied for circuit simulation. The mechanical simulation is also carried out by FEM method. A flexible and unified multiphysics field coupling mechanism is constructed to cover various electromagnetic, circuital, thermal and mechanical multiphysics coupling scenarios. Finally, three numerical examples emulating outer space environment, intense electromagnetic pulse (EMP) injection and high power microwave (HPM) illumination are utilized to demonstrate the accuracy, efficiency, and capability of the proposed method. The proposed method provides a versatile and powerful tool for the design and analysis of microwave circuits characterized by intertwined electromagnetic, circuital, thermal and stress behaviors.
Author Jia, Zheng Lang
Jiang, Li Jun
Liu, Ying
Zhang, Peng Fei
Ding, Da Zhi
Zhang, Huan Huan
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Cites_doi 10.1109/TMTT.2017.2687423
10.1109/TCS.1975.1084079
10.1109/TCPMT.2021.3121540
10.1109/TEMC.2018.2866023
10.1109/TEMC.2016.2597311
10.1109/75.661137
10.1109/TEMC.2016.2642955
10.1109/TMTT.2003.821929
10.1109/TMTT.2013.2261085
10.1109/TMTT.2010.2086590
10.1109/TMAG.2014.2360841
10.1109/TMTT.2021.3091131
10.1109/8.791939
10.1109/TMTT.2018.2851220
10.1109/LAWP.2018.2856365
10.1109/22.769319
10.1109/TMTT.2019.2919838
10.1109/22.552039
10.1109/TCPMT.2016.2639359
10.1109/22.473179
10.1109/TMTT.2022.3164703
10.1080/02726349608908487
10.1109/TAP.2016.2560901
10.1007/BF01213997
10.1109/TMTT.2017.2785800
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References ref13
ref12
ref15
ref14
ref11
ref10
ref2
ref1
ref17
ref16
ref19
ref18
ref24
ref23
ref25
ref20
ref22
ref21
ref8
ref7
ref9
ref4
ref3
ref6
ref5
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  doi: 10.1109/TMTT.2017.2687423
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  doi: 10.1109/TCS.1975.1084079
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  doi: 10.1109/TCPMT.2021.3121540
– ident: ref5
  doi: 10.1109/TEMC.2018.2866023
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  doi: 10.1109/TEMC.2016.2597311
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  doi: 10.1109/TMTT.2021.3091131
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  doi: 10.1109/8.791939
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  doi: 10.1109/TMTT.2018.2851220
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  doi: 10.1109/LAWP.2018.2856365
– ident: ref7
  doi: 10.1109/22.769319
– ident: ref2
  doi: 10.1109/TMTT.2019.2919838
– ident: ref14
  doi: 10.1109/22.552039
– ident: ref20
  doi: 10.1109/TCPMT.2016.2639359
– ident: ref13
  doi: 10.1109/22.473179
– ident: ref18
  doi: 10.1109/TMTT.2022.3164703
– ident: ref24
  doi: 10.1080/02726349608908487
– ident: ref10
  doi: 10.1109/TAP.2016.2560901
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Snippet A electromagnetic-circuital-thermal-mechanical mu- ltiphysics numerical method is proposed for the simulation of microwave circuits. The discontinuous Galerkin...
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SubjectTerms Aerospace environments
Circuit design
Computational modeling
Computer simulation
Coupling
discontinuous Galerkin time-domain method
Electromagnetic heating
Electromagnetic pulses
Electromagnetics
Finite element analysis
Finite element method
High power microwaves
Method of moments
Microwave circuits
Microwave FET integrated circuits
Microwave integrated circuits
Microwave theory and techniques
Microwave transistors
Multiphysics simulation
Numerical methods
Physics computing
Thermal simulation
Time domain analysis
Title Electromagnetic-Circuital-Thermal-Mechanical Multiphysics Numerical Simulation Method for Microwave Circuits
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