Efficient Barrett Modular Multiplication Based on Toom-Cook Multiplication

The Toom-Cook multiplier (TCM) is the most suitable method for multiplying large integers with key widths typically employed in ECC or RSA due to its computational efficiency. In this brief, we improve the accuracy of hardware TCM algorithm, and propose a TCM-based Barrett modular multiplication alg...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on circuits and systems. II, Express briefs Vol. 71; no. 2; pp. 862 - 866
Main Authors: Hao, Yue, Wang, Weijiang, Dang, Hua, Wang, Guiyu
Format: Journal Article
Language:English
Published: New York IEEE 01.02.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:
Algorithms
ASIC implementation
Barrett modular multiplication
Complexity theory
Hardware
Integrated circuits
Interpolation
Modular multiplier
Multiplication
Multipliers
precompute
Robustness
Robustness (mathematics)
Security
Termination of employment
Toom-Cook multiplication
ISSN:1549-7747, 1558-3791
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The Toom-Cook multiplier (TCM) is the most suitable method for multiplying large integers with key widths typically employed in ECC or RSA due to its computational efficiency. In this brief, we improve the accuracy of hardware TCM algorithm, and propose a TCM-based Barrett modular multiplication algorithm. We provide detailed mathematical proofs for the determination of parameters, error ranges, and input-output bounds, which serve to validate the robustness and reliability of our proposed algorithm. Further, the hardware architecture and the ASIC implementation results under 40nm, 65nm, 90nm process are presented. Compared with existing works, the proposed modular multiplier exhibits superior performance in terms of Area-Time-Product.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:1549-7747
1558-3791
DOI:10.1109/TCSII.2023.3313783