Choi, Y., Lee, H., & Chae, S. (2021). High Throughput CBAC Hardware Encoder With Bin Merging for AVS 2.0 Video Coding. IEEE transactions on circuits and systems for video technology, 31(11), 4439-4453. https://doi.org/10.1109/TCSVT.2020.3047925
Citace podle Chicago (17th ed.)Choi, Young-Kyu, Hyuk-Jae Lee, a Soo-Ik Chae. "High Throughput CBAC Hardware Encoder With Bin Merging for AVS 2.0 Video Coding." IEEE Transactions on Circuits and Systems for Video Technology 31, no. 11 (2021): 4439-4453. https://doi.org/10.1109/TCSVT.2020.3047925.
Citace podle MLA (9th ed.)Choi, Young-Kyu, et al. "High Throughput CBAC Hardware Encoder With Bin Merging for AVS 2.0 Video Coding." IEEE Transactions on Circuits and Systems for Video Technology, vol. 31, no. 11, 2021, pp. 4439-4453, https://doi.org/10.1109/TCSVT.2020.3047925.