Anomaly Detection for Solder Joints Using β-VAE

In the assembly process of printed circuit boards (PCBs), most of the errors are caused by solder joints in surface mount devices (SMDs). In the literature, traditional feature extraction-based methods require designing hand-crafted features and rely on the tiered red green blue (RGB) illumination t...

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Vydáno v:	IEEE transactions on components, packaging, and manufacturing technology (2011) Ročník 11; číslo 12; s. 2214 - 2221
Hlavní autoři:	Ulger, Furkan, Yuksel, Seniha Esen, Yilmaz, Atila
Médium:	Journal Article
Jazyk:	angličtina
Vydáno:	Piscataway IEEE 01.12.2021 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Témata:	<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">β -variational autoencoder (VAE) Accuracy Anomalies Anomaly detection Artificial neural networks automated optical inspection (AOI) Automatic optical inspection Circuit boards Errors Feature extraction Illumination Inspection Integrated circuits Model accuracy Representations solder joint inspection (SJI) Soldered joints Soldering Solders Surface-mounted devices Training unsupervised anomaly detection VAE
ISSN:	2156-3950, 2156-3985
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