Ulger, F., Yuksel, S. E., & Yilmaz, A. (2021). Anomaly Detection for Solder Joints Using β-VAE. IEEE transactions on components, packaging, and manufacturing technology (2011), 11(12), 2214-2221. https://doi.org/10.1109/TCPMT.2021.3121265
Citácia podle Chicago (17th ed.)Ulger, Furkan, Seniha Esen Yuksel, a Atila Yilmaz. "Anomaly Detection for Solder Joints Using β-VAE." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011) 11, no. 12 (2021): 2214-2221. https://doi.org/10.1109/TCPMT.2021.3121265.
Citácia podľa MLA (8th ed.)Ulger, Furkan, et al. "Anomaly Detection for Solder Joints Using β-VAE." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011), vol. 11, no. 12, 2021, pp. 2214-2221, https://doi.org/10.1109/TCPMT.2021.3121265.