Electrical-Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition...

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Bibliographic Details
Published in:	IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 4; no. 4; pp. 588 - 601
Main Authors:	Xie, Jianyong, Swaminathan, Madhavan
Format:	Journal Article
Language:	English
Published:	Piscataway IEEE 01.04.2014 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:	Algorithms Boundary conditions Cascadic multigrid (CMG) method Decomposition domain decomposition Equations Finite element analysis Joule heating Lagrange multipliers Mathematical model Mortar finite element method (FEM) multiscale preconditioned conjugate gradient (PCG) method Resistance heating Thermal analysis through-silicon via (TSV) voltage drop
ISSN:	2156-3950, 2156-3985
Online Access:	Get full text
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