Electrical-Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition...

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Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology (2011) Jg. 4; H. 4; S. 588 - 601
Hauptverfasser: Xie, Jianyong, Swaminathan, Madhavan
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Piscataway IEEE 01.04.2014
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Schlagworte:
Algorithms
Boundary conditions
Cascadic multigrid (CMG) method
Decomposition
domain decomposition
Equations
Finite element analysis
Joule heating
Lagrange multipliers
Mathematical model
Mortar finite element method (FEM)
multiscale
preconditioned conjugate gradient (PCG) method
Resistance heating
Thermal analysis
through-silicon via (TSV)
voltage drop
ISSN:2156-3950, 2156-3985
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Abstract Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition method is proposed. Using the nonconformal domain decomposition approach, integrated systems can be divided into separate subdomains. Individual subdomains can be discretized independently based on its detailed feature size and formulated using the finite element method with associated boundary conditions. The coupling between domains is captured using Lagrange multipliers. For large multiscale 3-D problems, the cascadic multigrid method combined with the subspace confined preconditioned conjugate gradient method is used to accelerate the convergence of the solution with hierarchical meshing grids. Several examples are simulated and the results validate the accuracy and efficiency of the electrical-thermal cosimulation using nonconformal domain decomposition.
AbstractList Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition method is proposed. Using the nonconformal domain decomposition approach, integrated systems can be divided into separate subdomains. Individual subdomains can be discretized independently based on its detailed feature size and formulated using the finite element method with associated boundary conditions. The coupling between domains is captured using Lagrange multipliers. For large multiscale 3-D problems, the cascadic multigrid method combined with the subspace confined preconditioned conjugate gradient method is used to accelerate the convergence of the solution with hierarchical meshing grids. Several examples are simulated and the results validate the accuracy and efficiency of the electrical-thermal cosimulation using nonconformal domain decomposition.
Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition method is proposed. Using the nonconformal domain decomposition approach, integrated systems can be divided into separate subdomains. Individual subdomains can be discretized independently based on its detailed feature size and formulated using the finite element method with associated boundary conditions. The coupling between domains is captured using Lagrange multipliers. For large multiscale 3-D problems, the cascadic multigrid method combined with the subspace confined preconditioned conjugate gradient method is used to accelerate the convergence of the solution with hierarchical meshing grids. Several examples are simulated and the results validate the accuracy and efficiency of the electrical-thermal cosimulation using nonconformal domain decomposition. [PUBLICATION ABSTRACT]
Author Xie, Jianyong
Swaminathan, Madhavan
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Cites_doi 10.1109/TCAD.2005.858276
10.1109/ICCAD.2011.6105381
10.1109/ISQED.2010.5450430
10.1109/ISQED.2008.4479725
10.1145/2429384.2429452
10.1109/TAP.2005.863095
10.1109/TCPMT.2010.2101770
10.1109/ESTC.2010.5642927
10.1007/s002110050468
10.1109/43.828554
10.1016/S0168-9274(96)00059-1
10.1109/TEMC.2010.2045382
10.1109/3DIC.2009.5306525
10.1007/s00607-002-1460-2
10.1098/rspa.2011.0708
10.1109/DATE.2007.364517
10.1137/S0036142998335431
10.1007/978-3-540-78841-6_10
10.1109/20.877690
10.1109/TCAD.2007.895754
10.1109/TCAD.2002.804385
10.1109/TADVP.2010.2090348
10.1109/EPEPS.2010.5642582
10.1109/95.725203
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References ref31
ref30
ref10
ref2
(ref1) 2006
ref16
ref19
ref18
xie (ref11) 2012
(ref17) 2001
ref24
ref23
ref26
ref25
jin (ref13) 2002
ref20
ref22
ref21
ref28
ref27
ref29
ref8
saad (ref14) 2000
ref4
ref3
chee-hoe (ref7) 2006
belgacem (ref15) 1999; 84
ref6
li (ref9) 2006; 25
ref5
peterson (ref12) 1998
References_xml – volume: 25
  start-page: 1763
  year: 2006
  ident: ref9
  article-title: IC thermal simulation and modeling via efficient multigrid-based approaches
  publication-title: IEEE Trans Comput Aided Design Integr Circuits
  doi: 10.1109/TCAD.2005.858276
– ident: ref28
  doi: 10.1109/ICCAD.2011.6105381
– ident: ref26
  doi: 10.1109/ISQED.2010.5450430
– start-page: 651
  year: 2012
  ident: ref11
  article-title: Fast electrical?thermal co-simulation with multigrid method for 3D integration
  publication-title: Proc ECTC
– year: 1998
  ident: ref12
  publication-title: Computational Method for Electromagnetics
– ident: ref29
  doi: 10.1109/ISQED.2008.4479725
– ident: ref27
  doi: 10.1145/2429384.2429452
– ident: ref25
  doi: 10.1109/TAP.2005.863095
– ident: ref4
  doi: 10.1109/TCPMT.2010.2101770
– ident: ref3
  doi: 10.1109/ESTC.2010.5642927
– volume: 84
  start-page: 173
  year: 1999
  ident: ref15
  article-title: The mortar finite element method with Lagrange multipliers
  publication-title: Numeric Math
  doi: 10.1007/s002110050468
– start-page: 849
  year: 2006
  ident: ref7
  article-title: Current density and hot spot prediction using electrical?thermal co-simulation for multi-layer IC packages
  publication-title: Proc 8th EPTC
– ident: ref8
  doi: 10.1109/43.828554
– year: 2001
  ident: ref17
  publication-title: Ulrich Trottenberg
– ident: ref20
  doi: 10.1016/S0168-9274(96)00059-1
– year: 2002
  ident: ref13
  publication-title: The Finite Element Method in Electromagnetics
– ident: ref22
  doi: 10.1109/TEMC.2010.2045382
– ident: ref2
  doi: 10.1109/3DIC.2009.5306525
– ident: ref18
  doi: 10.1007/s00607-002-1460-2
– ident: ref31
  doi: 10.1098/rspa.2011.0708
– ident: ref30
  doi: 10.1109/DATE.2007.364517
– year: 2000
  ident: ref14
  publication-title: Iterative methods for sparse linear systems
– ident: ref16
  doi: 10.1137/S0036142998335431
– ident: ref19
  doi: 10.1007/978-3-540-78841-6_10
– ident: ref24
  doi: 10.1109/20.877690
– ident: ref10
  doi: 10.1109/TCAD.2007.895754
– year: 2006
  ident: ref1
  publication-title: International Technology Roadmap for Semiconductors
– ident: ref21
  doi: 10.1109/TCAD.2002.804385
– ident: ref23
  doi: 10.1109/TADVP.2010.2090348
– ident: ref5
  doi: 10.1109/EPEPS.2010.5642582
– ident: ref6
  doi: 10.1109/95.725203
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SubjectTerms Algorithms
Boundary conditions
Cascadic multigrid (CMG) method
Decomposition
domain decomposition
Equations
Finite element analysis
Joule heating
Lagrange multipliers
Mathematical model
Mortar finite element method (FEM)
multiscale
preconditioned conjugate gradient (PCG) method
Resistance heating
Thermal analysis
through-silicon via (TSV)
voltage drop
Title Electrical-Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems
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