Optimizing Vertical Link Placement and Congestion Aware Dynamic Elevator Assignment for Partially Connected 3D-NoCs

The fully connected 3D-NoCs in which all routers are vertically connected with their neighbors above and below need a lot of Through-Silicon-Vias (TSVs), and they will occupy a large silicon area and reduce the fabrication yield. Thus, the idea of partially connected 3D-NoCs has emerged. The optimal...

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Vydáno v:	IEEE transactions on computer-aided design of integrated circuits and systems Ročník 40; číslo 10; s. 1957 - 1970
Hlavní autoři:	Fu, Yuxiang, Zhang, Chuan, Song, Wenqing, Chen, Qinyu, Chen, Hui, Zhou, Minghao, Li, Li
Médium:	Journal Article
Jazyk:	angličtina
Vydáno:	New York IEEE 01.10.2021 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Témata:	3-D NoC assignment Component reliability Design optimization Distance factor Elevators Genetic algorithms Multiple objective analysis Optimization partially connected Placement Routers Routing Silicon Tabu search Three-dimensional displays Through-silicon vias through-silicon-via (TSV) vertical links
ISSN:	0278-0070, 1937-4151
On-line přístup:	Získat plný text
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