Lin, M., Hsieh, S., Chen, C., & Lin, C. (2024). High-Performance Chip Design with Parallel Architecture for Magnetic Field Imaging System. IEEE transactions on instrumentation and measurement, 73, 1. https://doi.org/10.1109/TIM.2023.3334351
Citace podle Chicago (17th ed.)Lin, Ming-Yi, Sheng-Hsien Hsieh, Ching-Han Chen, a Chun-Hung Lin. "High-Performance Chip Design with Parallel Architecture for Magnetic Field Imaging System." IEEE Transactions on Instrumentation and Measurement 73 (2024): 1. https://doi.org/10.1109/TIM.2023.3334351.
Citace podle MLA (9th ed.)Lin, Ming-Yi, et al. "High-Performance Chip Design with Parallel Architecture for Magnetic Field Imaging System." IEEE Transactions on Instrumentation and Measurement, vol. 73, 2024, p. 1, https://doi.org/10.1109/TIM.2023.3334351.