Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test

Wafer probing test is crucial for selecting the known good dies via the probe card as the testing signal interface between the tester and the integrated circuits on the fabricated wafers. The consistency of probe cards is critical to ensure the integrity of the testing data. Motivated by realistic n...

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Vydáno v:	IEEE transactions on semiconductor manufacturing Ročník 37; číslo 4; s. 567 - 575
Hlavní autoři:	Chien, Chen-Fu, Suwattananuruk, Butsayarin
Médium:	Journal Article
Jazyk:	angličtina
Vydáno:	New York IEEE 01.11.2024 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Témata:	Cluster analysis Clustering Clustering methods Inspection Integrated circuits Integrity Materials selection Noise control PCB selection Printed circuits probe card Probes Quality control Semiconductor device manufacture semiconductor manufacturing Signal quality spatial clustering Spatial data Supply chains Wafer probing test
ISSN:	0894-6507, 1558-2345
On-line přístup:	Získat plný text
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