An Angle-Insensitive 3-Bit Reconfigurable Intelligent Surface

Recently, reconfigurable intelligent surface (RIS) has attracted continuous attention in wireless communications. Because the normal incidence condition of electromagnetic waves cannot always be satisfied in practical applications, the angular insensitivity in RISs has become an important issue. The...

Celý popis

Uloženo v:

Podrobná bibliografie
Vydáno v:	IEEE transactions on antennas and propagation Ročník 70; číslo 10; s. 8798 - 8808
Hlavní autoři:	Liang, Jing Cheng, Cheng, Qiang, Gao, Yuan, Xiao, Cong, Gao, Shang, Zhang, Lei, Jin, Shi, Cui, Tie Jun
Médium:	Journal Article
Jazyk:	angličtina
Vydáno:	New York IEEE 01.10.2022 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Témata:	3-Bit programmable metasurface angular insensitivity angular reciprocity Ash Communication networks Copper Decoupling Electromagnetic radiation Encoding Incidence angle oblique incidence Reciprocity reconfigurable intelligent surface (RIS) Reconfigurable intelligent surfaces Substrates Wireless communications Wireless networks
ISSN:	0018-926X, 1558-2221
On-line přístup:	Získat plný text
Tagy:	Přidat tag Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!

Abstract	Recently, reconfigurable intelligent surface (RIS) has attracted continuous attention in wireless communications. Because the normal incidence condition of electromagnetic waves cannot always be satisfied in practical applications, the angular insensitivity in RISs has become an important issue. The angular sensitivity in RISs may lead to the failure of RIS-assisted wireless communication networks that rely on the reciprocity of wireless channels. In this work, an angle-insensitive 3-bit RIS meta-atom is proposed. By introducing metallic vias in the substrate of programmable meta-atoms, the interference induced by multiple reflections in the multilayered structure is restrained, and the decoupling between adjacent meta-atoms makes the metasurface insensitive to the incident angle. Hence the angular insensitivity can be achieved. An RIS is fabricated using the proposed angle-insensitive programmable meta-atom with metallic vias, which is capable of maintaining stable phase and amplitude responses at oblique incidences. Both simulated and measured results show stable angle performance. A maximum of 315° phase range and eight digital coding states with 45° stable interval are obtained for wide incidence angles from 0° to 60°. Finally, numerical simulations and experimental results of anomalous reflections are performed to verify the angular reciprocity of the proposed RIS, which is important in wireless communications.
AbstractList	Recently, reconfigurable intelligent surface (RIS) has attracted continuous attention in wireless communications. Because the normal incidence condition of electromagnetic waves cannot always be satisfied in practical applications, the angular insensitivity in RISs has become an important issue. The angular sensitivity in RISs may lead to the failure of RIS-assisted wireless communication networks that rely on the reciprocity of wireless channels. In this work, an angle-insensitive 3-bit RIS meta-atom is proposed. By introducing metallic vias in the substrate of programmable meta-atoms, the interference induced by multiple reflections in the multilayered structure is restrained, and the decoupling between adjacent meta-atoms makes the metasurface insensitive to the incident angle. Hence the angular insensitivity can be achieved. An RIS is fabricated using the proposed angle-insensitive programmable meta-atom with metallic vias, which is capable of maintaining stable phase and amplitude responses at oblique incidences. Both simulated and measured results show stable angle performance. A maximum of 315° phase range and eight digital coding states with 45° stable interval are obtained for wide incidence angles from 0° to 60°. Finally, numerical simulations and experimental results of anomalous reflections are performed to verify the angular reciprocity of the proposed RIS, which is important in wireless communications.
Author	Cheng, Qiang Gao, Yuan Liang, Jing Cheng Gao, Shang Xiao, Cong Jin, Shi Cui, Tie Jun Zhang, Lei
Author_xml	– sequence: 1 givenname: Jing Cheng orcidid: 0000-0002-2653-5113 surname: Liang fullname: Liang, Jing Cheng organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China – sequence: 2 givenname: Qiang orcidid: 0000-0002-2442-8357 surname: Cheng fullname: Cheng, Qiang email: qiangcheng@seu.edu.cn organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China – sequence: 3 givenname: Yuan surname: Gao fullname: Gao, Yuan organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China – sequence: 4 givenname: Cong surname: Xiao fullname: Xiao, Cong organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China – sequence: 5 givenname: Shang surname: Gao fullname: Gao, Shang organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China – sequence: 6 givenname: Lei orcidid: 0000-0002-8791-6374 surname: Zhang fullname: Zhang, Lei organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China – sequence: 7 givenname: Shi orcidid: 0000-0003-0271-6021 surname: Jin fullname: Jin, Shi organization: National Mobile Communications Research Laboratory, Southeast University, Nanjing, China – sequence: 8 givenname: Tie Jun orcidid: 0000-0002-5862-1497 surname: Cui fullname: Cui, Tie Jun email: tjcui@seu.edu.cn organization: State Key Laboratory of Millimeter Wave, Southeast University, Nanjing, China
BookMark	eNp9kE1LAzEQhoMo2FbvgpcFz1vzuZscPNTiR6GgaAVvIbs7KSlrtiZZwX_vlhYPHpzLy8D7zMAzRse-84DQBcFTQrC6Xs2epxRTMmWEYYLlERoRIWROKSXHaIQxkbmixfspGse4GVYuOR-hm5nPZn7dQr7wEXx0yX1BxvJbl7IXqDtv3boPpmohW_gEbevW4FP22gdrajhDJ9a0Ec4POUFv93er-WO-fHpYzGfLvKaKpNwqqSSrBWcVbZqysJRKy8FgabCRTdNUgisjjbAVEU0FXAFlZVPWhcKsFIZN0NX-7jZ0nz3EpDddH_zwUtOScSaHEUOr2Lfq0MUYwOraJZNc51MwrtUE650qPajSO1X6oGoA8R9wG9yHCd__IZd7xAHAb10VjDJF2Q_xz3Td
CODEN	IETPAK
CitedBy_id	crossref_primary_10_1109_TCOMM_2024_3382332 crossref_primary_10_1038_s41467_024_54672_6 crossref_primary_10_1109_TAP_2025_3558424 crossref_primary_10_1002_aelm_202500446 crossref_primary_10_1109_LAWP_2024_3367732 crossref_primary_10_1109_TAP_2024_3407964 crossref_primary_10_1515_nanoph_2023_0947 crossref_primary_10_1109_ACCESS_2025_3575583 crossref_primary_10_1109_TAP_2024_3507617 crossref_primary_10_1109_JSTSP_2024_3435465 crossref_primary_10_1631_FITEE_2300146 crossref_primary_10_1109_TAP_2023_3340769 crossref_primary_10_1109_TAP_2024_3463872 crossref_primary_10_1109_TAP_2024_3381376 crossref_primary_10_1109_LAWP_2025_3579681 crossref_primary_10_1109_JIOT_2024_3524256 crossref_primary_10_1109_LAWP_2024_3435829 crossref_primary_10_1002_adom_202102400 crossref_primary_10_1109_TWC_2023_3331054 crossref_primary_10_3390_electronics12204220 crossref_primary_10_1109_TAP_2024_3451162 crossref_primary_10_1007_s11432_023_3788_y crossref_primary_10_1016_j_optcom_2025_131483 crossref_primary_10_1002_lpor_202400049 crossref_primary_10_1109_TAP_2022_3221840 crossref_primary_10_1109_TAP_2024_3436679 crossref_primary_10_1109_TAP_2025_3565007 crossref_primary_10_1109_TAP_2024_3520797 crossref_primary_10_1080_17455030_2024_2382151 crossref_primary_10_1109_TMTT_2023_3259526 crossref_primary_10_3390_electronics13091648 crossref_primary_10_1109_TAP_2024_3486014 crossref_primary_10_1109_TVT_2024_3356592 crossref_primary_10_1631_FITEE_2300113 crossref_primary_10_1063_5_0198211 crossref_primary_10_1109_TMTT_2024_3506218 crossref_primary_10_1002_lpor_202501115 crossref_primary_10_1109_MNET_2024_3480332 crossref_primary_10_1007_s11468_023_02132_0 crossref_primary_10_1016_j_eng_2025_08_040 crossref_primary_10_1109_ACCESS_2023_3236909 crossref_primary_10_1109_JLT_2024_3384477 crossref_primary_10_1002_lpor_202500184 crossref_primary_10_1109_TAP_2024_3352828 crossref_primary_10_1016_j_phycom_2025_102664 crossref_primary_10_1515_nanoph_2023_0569 crossref_primary_10_1002_lpor_202400255 crossref_primary_10_1088_1361_6463_ad5020 crossref_primary_10_3788_COL202321_080005 crossref_primary_10_1109_LAWP_2024_3428318 crossref_primary_10_1002_sdtp_16735 crossref_primary_10_1109_ACCESS_2025_3555197 crossref_primary_10_1109_TAP_2023_3335821 crossref_primary_10_1109_TAP_2022_3225593 crossref_primary_10_1038_s41467_024_47865_6 crossref_primary_10_3390_e25121638 crossref_primary_10_1109_TAP_2023_3305053 crossref_primary_10_1109_ACCESS_2022_3226264 crossref_primary_10_1109_LAWP_2024_3521884 crossref_primary_10_1109_TAP_2024_3349778 crossref_primary_10_1109_TAP_2022_3176868 crossref_primary_10_1002_advs_202403624 crossref_primary_10_1109_TAP_2024_3375659 crossref_primary_10_1002_lpor_202501068 crossref_primary_10_1002_admt_202400850 crossref_primary_10_1002_adfm_202503273 crossref_primary_10_1002_adfm_202421498 crossref_primary_10_1088_1361_6463_ad7510 crossref_primary_10_1109_TMTT_2023_3312978 crossref_primary_10_1109_JIOT_2024_3441035 crossref_primary_10_1109_TWC_2023_3317834 crossref_primary_10_3390_electronics12214489 crossref_primary_10_3390_electronics14091893 crossref_primary_10_1038_s41598_023_48306_y crossref_primary_10_1088_1361_6463_ace198 crossref_primary_10_1109_TAP_2025_3544663 crossref_primary_10_1109_TMTT_2025_3546554 crossref_primary_10_1002_advs_202203747 crossref_primary_10_1109_MCOM_001_2300314 crossref_primary_10_1002_adfm_202401909 crossref_primary_10_3389_fmats_2022_946163 crossref_primary_10_1016_j_jiixd_2023_06_008 crossref_primary_10_1109_ACCESS_2022_3205117 crossref_primary_10_1016_j_jiixd_2023_06_009 crossref_primary_10_1080_23080477_2024_2358671 crossref_primary_10_34133_research_0820
Cites_doi	10.1049/ip-map:20040726 10.1002/adma.201401484 10.1109/TAP.2018.2866636 10.1038/s41467-017-00164-9 10.1109/apmc46564.2019.9038764 10.1109/LCOMM.2020.2993961 10.1038/s41928-021-00554-4 10.1038/srep42302 10.1038/srep03059 10.1109/MWC.001.1900308 10.1109/twc.2020.3024887 10.1109/ISAPE.2018.8634196 10.1038/lsa.2014.99 10.1109/TAP.2019.2955219 10.1063/1.4826522 10.1109/TMTT.2013.2279776 10.1109/TCOMM.2020.3001125 10.1038/s41377-019-0205-3 10.1109/JSAC.2020.3007211 10.1109/ACCESS.2019.2935192 10.1049/el.2019.0400 10.1038/s41467-018-06802-0 10.1002/admt.201900044 10.1109/TMTT.2004.839303 10.1109/LAWP.2014.2355252 10.1038/srep20663 10.1002/adom.202001689 10.1016/j.isci.2020.101403 10.1126/science.1210713 10.1016/j.scib.2020.03.016 10.1364/OE.20.007165 10.1134/1.1340895 10.1038/srep35692 10.1002/adma.201904069 10.1002/9780470290996 10.23919/j.cc.2019.05.004 10.1109/TWC.2019.2936025
ContentType	Journal Article
Copyright	Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
Copyright_xml	– notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
DBID	97E RIA RIE AAYXX CITATION 7SP 8FD L7M
DOI	10.1109/TAP.2021.3130108
DatabaseName	IEEE All-Society Periodicals Package (ASPP) 2005-present IEEE All-Society Periodicals Package (ASPP) 1998-Present IEEE Electronic Library Online CrossRef Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace
DatabaseTitle	CrossRef Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts
DatabaseTitleList	Technology Research Database
Database_xml	– sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://ieeexplore.ieee.org/ sourceTypes: Publisher
DeliveryMethod	fulltext_linktorsrc
Discipline	Engineering
EISSN	1558-2221
EndPage	8808
ExternalDocumentID	10_1109_TAP_2021_3130108 9632392
Genre	orig-research
GrantInformation_xml	– fundername: National Natural Science Foundation of China grantid: 61631007; 61571117; 61138001; 61371035; 61722106; 61731010; 11227904 funderid: 10.13039/501100001809 – fundername: National Key Research and Development Program of China grantid: 2017YFA0700201; 2017YFA0700202; 2017YFA0700203 funderid: 10.13039/501100012166 – fundername: Higher Education Discipline Innovation Project; 111 Project grantid: 111-2-05 funderid: 10.13039/501100013314
GroupedDBID	-~X 0R~ 29I 4.4 5GY 5VS 6IK 85S 97E AAJGR AARMG AASAJ AAWTH ABAZT ABFSI ABQJQ ABVLG ACGFO ACGFS ACIWK ACKIV ACNCT AENEX AETIX AGQYO AGSQL AHBIQ AI. AIBXA AKJIK AKQYR ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 E.L EBS EJD F5P HZ~ H~9 IAAWW IBMZZ ICLAB IDIHD IFIPE IFJZH IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RNS RXW TAE TAF TN5 VH1 VJK VOH AAYXX CITATION 7SP 8FD L7M
ID	FETCH-LOGICAL-c291t-f98983c543b2dd76f228f4ea08a0a8dddb549a8a5fb15dbe49e237d7c690375a3
IEDL.DBID	RIE
ISICitedReferencesCount	130
ISICitedReferencesURI	http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=000880709700016&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
ISSN	0018-926X
IngestDate	Mon Jun 30 10:10:51 EDT 2025 Tue Nov 18 22:16:38 EST 2025 Sat Nov 29 05:23:16 EST 2025 Wed Aug 27 03:05:00 EDT 2025
IsPeerReviewed	true
IsScholarly	true
Issue	10
Language	English
License	https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html https://doi.org/10.15223/policy-029 https://doi.org/10.15223/policy-037
LinkModel	DirectLink
MergedId	FETCHMERGED-LOGICAL-c291t-f98983c543b2dd76f228f4ea08a0a8dddb549a8a5fb15dbe49e237d7c690375a3
Notes	ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14
ORCID	0000-0002-2442-8357 0000-0002-8791-6374 0000-0002-5862-1497 0000-0002-2653-5113 0000-0003-0271-6021
PQID	2734388885
PQPubID	85476
PageCount	11
ParticipantIDs	ieee_primary_9632392 crossref_citationtrail_10_1109_TAP_2021_3130108 proquest_journals_2734388885 crossref_primary_10_1109_TAP_2021_3130108
PublicationCentury	2000
PublicationDate	2022-10-01
PublicationDateYYYYMMDD	2022-10-01
PublicationDate_xml	– month: 10 year: 2022 text: 2022-10-01 day: 01
PublicationDecade	2020
PublicationPlace	New York
PublicationPlace_xml	– name: New York
PublicationTitle	IEEE transactions on antennas and propagation
PublicationTitleAbbrev	TAP
PublicationYear	2022
Publisher	IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml	– name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References	ref13 ref35 ref12 ref34 ref15 ref37 ref14 ref36 ref31 ref30 ref11 ref33 ref10 ref32 ref2 ref1 ref17 ref16 ref38 ref19 ref18 Taha (ref5) 2019 ref24 ref23 ref26 ref25 ref20 ref22 ref21 ref28 ref27 ref29 ref8 ref7 ref9 ref4 ref3 ref6
References_xml	– ident: ref29 doi: 10.1049/ip-map:20040726 – ident: ref12 doi: 10.1002/adma.201401484 – ident: ref35 doi: 10.1109/TAP.2018.2866636 – ident: ref21 doi: 10.1038/s41467-017-00164-9 – ident: ref23 doi: 10.1109/apmc46564.2019.9038764 – ident: ref26 doi: 10.1109/LCOMM.2020.2993961 – ident: ref7 doi: 10.1038/s41928-021-00554-4 – ident: ref20 doi: 10.1038/srep42302 – year: 2019 ident: ref5 article-title: Enabling large intelligent surfaces with compressive sensing and deep learning publication-title: arXiv:1904.10136 – ident: ref14 doi: 10.1038/srep03059 – ident: ref9 doi: 10.1109/MWC.001.1900308 – ident: ref25 doi: 10.1109/twc.2020.3024887 – ident: ref24 doi: 10.1109/ISAPE.2018.8634196 – ident: ref16 doi: 10.1038/lsa.2014.99 – ident: ref27 doi: 10.1109/TAP.2019.2955219 – ident: ref37 doi: 10.1063/1.4826522 – ident: ref34 doi: 10.1109/TMTT.2013.2279776 – ident: ref3 doi: 10.1109/TCOMM.2020.3001125 – ident: ref28 doi: 10.1038/s41377-019-0205-3 – ident: ref2 doi: 10.1109/JSAC.2020.3007211 – ident: ref4 doi: 10.1109/ACCESS.2019.2935192 – ident: ref11 doi: 10.1049/el.2019.0400 – ident: ref18 doi: 10.1038/s41467-018-06802-0 – ident: ref10 doi: 10.1002/admt.201900044 – ident: ref30 doi: 10.1109/TMTT.2004.839303 – ident: ref31 doi: 10.1109/LAWP.2014.2355252 – ident: ref17 doi: 10.1038/srep20663 – ident: ref13 doi: 10.1002/adom.202001689 – ident: ref1 doi: 10.1016/j.isci.2020.101403 – ident: ref38 doi: 10.1126/science.1210713 – ident: ref22 doi: 10.1016/j.scib.2020.03.016 – ident: ref36 doi: 10.1364/OE.20.007165 – ident: ref32 doi: 10.1134/1.1340895 – ident: ref15 doi: 10.1038/srep35692 – ident: ref19 doi: 10.1002/adma.201904069 – ident: ref33 doi: 10.1002/9780470290996 – ident: ref8 doi: 10.23919/j.cc.2019.05.004 – ident: ref6 doi: 10.1109/TWC.2019.2936025
SSID	ssj0014844
Score	2.6629007
Snippet	Recently, reconfigurable intelligent surface (RIS) has attracted continuous attention in wireless communications. Because the normal incidence condition of...
SourceID	proquest crossref ieee
SourceType	Aggregation Database Enrichment Source Index Database Publisher
StartPage	8798
SubjectTerms	3-Bit programmable metasurface angular insensitivity angular reciprocity Ash Communication networks Copper Decoupling Electromagnetic radiation Encoding Incidence angle oblique incidence Reciprocity reconfigurable intelligent surface (RIS) Reconfigurable intelligent surfaces Substrates Wireless communications Wireless networks
Title	An Angle-Insensitive 3-Bit Reconfigurable Intelligent Surface
URI	https://ieeexplore.ieee.org/document/9632392 https://www.proquest.com/docview/2734388885
Volume	70
WOSCitedRecordID	wos000880709700016&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
hasFullText	1
inHoldings	1
isFullTextHit
isPrint
journalDatabaseRights	– providerCode: PRVIEE databaseName: IEEE Electronic Library (IEL) customDbUrl: eissn: 1558-2221 dateEnd: 99991231 omitProxy: false ssIdentifier: ssj0014844 issn: 0018-926X databaseCode: RIE dateStart: 19630101 isFulltext: true titleUrlDefault: https://ieeexplore.ieee.org/ providerName: IEEE
link	http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3PS8MwFH5sw4Me_DXF6ZQevAjWtUnapscpDncZAyfsVvJzDEYnW-vfb5J2ZaAI3npIoHx5yXtfXt77AO6N05cmbhc-18aCCYuJz7kIfE0wEVQIGdZiE8lkQufzdNqCx6YWRinlHp-pJ_vpcvlyLUp7VTYwxoKMP29DO0mSqlaryRgQSqqOy6HZwCie71KSQTqYDaeGCKLQ8FNjzlZIcs8FOU2VHwex8y6jk__91ykc11GkN6yW_QxaKj-Ho73egl0wxN4b5ouV8sf2-njr3gh52H9eFp7lnLleLsqNLZzyxk1bzsJ7LzeaCXUBH6PX2cubX2sl-AKlYeFrqwOJRUQwR1ImsUaIaqJYQFnAqJSSGyLIKIs0DyPJFUkVwolMhGHHOIkYvoROvs7VFXiRYjSIGI01NZhqzTE3MSRLNdMppzLswWAHXybqRuJWz2KVOUIRpJkBPLOAZzXgPXhoZnxWTTT-GNu1ADfjamx70N-tUFbvsm1mW_NgQ-FpdP37rBs4RLZcwT2-60On2JTqFg7EV7Hcbu6cAX0DpxXCSA
linkProvider	IEEE
linkToHtml	http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3PS8MwFH7MKagHf4vTqT14Eaxrk7RNj1McG84xcMJuJT_HYHSydf79Jm1XBorgrYcEypeXvPfl5b0P4M44fWniduFybSyYsJC4nAvP1QQTQYWQfik2EQ0GdDyOhzV4qGphlFL54zP1aD_zXL6ci5W9KmsZY0HGn2_BdkAI8otqrSpnQCgpei77ZgujcLxOSnpxa9QeGiqIfMNQjUFbKckNJ5Srqvw4inP_0jn8358dwUEZRzrtYuGPoabSE9jf6C54CobaO-10MlNuz14gL_NXQg52n6aZY1lnqqeT1cKWTjm9qjFn5ryvFpoJdQYfnZfRc9ct1RJcgWI_c7VVgsQiIJgjKaNQI0Q1UcyjzGNUSskNFWSUBZr7geSKxArhSEbC8GMcBQyfQz2dp-oCnEAx6gWMhpoaTLXmmJsoksWa6ZhT6TegtYYvEWUrcatoMUtySuHFiQE8sYAnJeANuK9mfBZtNP4Ye2oBrsaV2DaguV6hpNxny8Q258GGxNPg8vdZt7DbHb31k35v8HoFe8gWL-RP8ZpQzxYrdQ074iubLhc3uTF9A-9gxY8
openUrl	ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=An+Angle-Insensitive+3-Bit+Reconfigurable+Intelligent+Surface&rft.jtitle=IEEE+transactions+on+antennas+and+propagation&rft.au=Liang%2C+Jing+Cheng&rft.au=Cheng%2C+Qiang&rft.au=Gao%2C+Yuan&rft.au=Xiao%2C+Cong&rft.date=2022-10-01&rft.pub=IEEE&rft.issn=0018-926X&rft.volume=70&rft.issue=10&rft.spage=8798&rft.epage=8808&rft_id=info:doi/10.1109%2FTAP.2021.3130108&rft.externalDocID=9632392
thumbnail_l	http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0018-926X&client=summon
thumbnail_m	http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0018-926X&client=summon
thumbnail_s	http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0018-926X&client=summon