Active Reconfigurable Intelligent Surface for Mobile Edge Computing

This letter investigates an active reconfigurable intelligent surface (RIS)-aided mobile edge computing (MEC) system. Compared with passive RIS, the active RIS is equipped with active reflective amplifier, which can effectively circumvent the “double path loss” attenuation. We propose a joint comput...

Full description

Saved in:
Bibliographic Details
Published in:IEEE wireless communications letters Vol. 11; no. 12; p. 1
Main Authors: Peng, Zhangjie, Weng, Ruisong, Zhang, Zhenkun, Pan, Cunhua, Wang, Jiangzhou
Format: Journal Article
Language:English
Published: Piscataway IEEE 01.12.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:
active RIS
Array signal processing
Computational modeling
Edge computing
Internet of things
latency minimization
Mobile computing
Mobile edge computing (MEC)
Optimized production technology
Performance gain
reconfigurable intelligent surface (RIS)
Reconfigurable intelligent surfaces
Resource management
Servers
Task analysis
ISSN:2162-2337, 2162-2345
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Abstract This letter investigates an active reconfigurable intelligent surface (RIS)-aided mobile edge computing (MEC) system. Compared with passive RIS, the active RIS is equipped with active reflective amplifier, which can effectively circumvent the “double path loss” attenuation. We propose a joint computing and communication design to minimize the maximum computational latency (MCL), subject to both the phase shift constraints and the edge computing capability constraints. Specifically, the original problem is decoupled into four subproblems, and then the block coordinate descent (BCD) method and the successive convex approximation (SCA) method are applied to alternately optimize the subproblems. The simulation results show that with the same power budget, the performance gain achieved by the active RIS is much larger than that by the passive RIS.
AbstractList This letter investigates an active reconfigurable intelligent surface (RIS)-aided mobile edge computing (MEC) system. Compared with passive RIS, the active RIS is equipped with active reflective amplifier, which can effectively circumvent the “double path loss” attenuation. We propose a joint computing and communication design to minimize the maximum computational latency (MCL), subject to both the phase shift constraints and the edge computing capability constraints. Specifically, the original problem is decoupled into four subproblems, and then the block coordinate descent (BCD) method and the successive convex approximation (SCA) method are applied to alternately optimize the subproblems. The simulation results show that with the same power budget, the performance gain achieved by the active RIS is much larger than that by the passive RIS.
Author Peng, Zhangjie
Weng, Ruisong
Zhang, Zhenkun
Pan, Cunhua
Wang, Jiangzhou
Author_xml – sequence: 1
  givenname: Zhangjie
  orcidid: 0000-0002-1363-7022
  surname: Peng
  fullname: Peng, Zhangjie
  organization: College of Information, Mechanical and Electrical Engineering, Shanghai Normal University, Shanghai, China
– sequence: 2
  givenname: Ruisong
  surname: Weng
  fullname: Weng, Ruisong
  organization: College of Information, Mechanical and Electrical Engineering, Shanghai Normal University, Shanghai, China
– sequence: 3
  givenname: Zhenkun
  orcidid: 0000-0001-9766-9277
  surname: Zhang
  fullname: Zhang, Zhenkun
  organization: College of Information, Mechanical and Electrical Engineering, Shanghai Normal University, Shanghai, China
– sequence: 4
  givenname: Cunhua
  orcidid: 0000-0001-5286-7958
  surname: Pan
  fullname: Pan, Cunhua
  organization: National Mobile Communications Research Laboratory, Southeast University, Nanjing, China
– sequence: 5
  givenname: Jiangzhou
  orcidid: 0000-0003-0881-3594
  surname: Wang
  fullname: Wang, Jiangzhou
  organization: School of Engineering, University of Kent, Canterbury, U.K
BookMark eNp9kE1Lw0AQhhdRsNbeBS8Bz6n7lc3mWELVQkXwA4_LZjMbtqTZutkI_ntTWnrw4FxmYN5nBp4rdN75DhC6IXhOCC7u15_lnGJK54xiLjJxhiaUCJpSxrPz08zySzTr-w0eS2BCiZygcmGi-4bkFYzvrGuGoKsWklUXoW1dA11M3oZgtYHE-pA8-8qN62XdQFL67W6Irmuu0YXVbQ-zY5-ij4fle_mUrl8eV-VinRpakJgCkSajBedABZM5tXlRS1Mzog22OdPAcGUqwTXOtOR1TQ3ooqis1LnFtmBsiu4Od3fBfw3QR7XxQ-jGl4rmXGaCE8zHlDikTPB9H8Aq46KOzncxaNcqgtXemRqdqb0zdXQ2gvgPuAtuq8PPf8jtAXEAcIoXMpdEcPYLmpB4Hg
CODEN IWCLAF
CitedBy_id crossref_primary_10_1109_COMST_2023_3340099
crossref_primary_10_1109_TCOMM_2024_3471968
crossref_primary_10_1109_TWC_2024_3380841
crossref_primary_10_1109_JSAC_2024_3459028
crossref_primary_10_1109_TWC_2024_3456243
crossref_primary_10_1016_j_cosrev_2024_100668
crossref_primary_10_1109_TWC_2024_3367131
crossref_primary_10_1016_j_jnca_2024_104005
crossref_primary_10_1109_TCOMM_2023_3320700
crossref_primary_10_1109_LWC_2025_3542086
crossref_primary_10_3390_s25154878
crossref_primary_10_1109_TWC_2024_3391663
crossref_primary_10_1016_j_comcom_2024_107953
crossref_primary_10_1109_COMST_2024_3423460
crossref_primary_10_1109_LWC_2024_3487765
crossref_primary_10_1109_TWC_2023_3328308
crossref_primary_10_1109_TCE_2024_3365512
crossref_primary_10_1109_LWC_2024_3352637
crossref_primary_10_1109_ACCESS_2024_3443948
crossref_primary_10_1109_LWC_2024_3363214
crossref_primary_10_1109_JIOT_2025_3556246
crossref_primary_10_1109_JIOT_2024_3462899
crossref_primary_10_1109_JIOT_2023_3262645
crossref_primary_10_1109_JIOT_2024_3370557
crossref_primary_10_1109_TCOMM_2024_3476139
crossref_primary_10_1109_TWC_2024_3384501
crossref_primary_10_3390_s25041247
crossref_primary_10_1109_LCOMM_2024_3389990
crossref_primary_10_1007_s11432_023_3799_6
Cites_doi 10.1109/LCOMM.2021.3110714
10.1109/TWC.2020.3002891
10.1109/COMST.2017.2745201
10.1137/1.9780898718829
10.1109/LWC.2022.3193868
10.1109/JPROC.2018.2867029
10.1109/LCOMM.2022.3159525
10.1109/JSAC.2020.3007035
10.1109/TCOMM.2016.2599530
10.1109/TCOMM.2021.3051897
10.1109/TSP.2011.2147784
10.1017/CBO9780511804441
10.1109/MWC.001.2100142
10.1109/LWC.2020.3040607
10.1109/LWC.2021.3111044
10.1109/JIOT.2016.2579198
10.1109/TWC.2021.3064024
10.1109/TWC.2022.3206332
10.1109/TVT.2021.3135498
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
DOI 10.1109/LWC.2022.3204656
DatabaseName IEEE Xplore (IEEE)
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Xplore
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList Technology Research Database
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2162-2345
EndPage 1
ExternalDocumentID 10_1109_LWC_2022_3204656
9878164
Genre orig-research
GroupedDBID 0R~
4.4
5VS
6IK
97E
AAJGR
AASAJ
AAWTH
ABQJQ
ABVLG
AGQYO
AGSQL
AHBIQ
AKJIK
AKQYR
ALMA_UNASSIGNED_HOLDINGS
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
EJD
IES
IFIPE
IPLJI
JAVBF
M43
OCL
RIA
RIE
RNS
AAYXX
CITATION
7SP
8FD
AARMG
ABAZT
L7M
ID FETCH-LOGICAL-c291t-e18c52944e263872f79d8cd31ac0f73ae30bcb64a05a84dd2cea99bf8a7f0f933
IEDL.DBID RIE
ISICitedReferencesCount 30
ISICitedReferencesURI http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=000901617600004&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
ISSN 2162-2337
IngestDate Mon Jun 30 07:55:19 EDT 2025
Sat Nov 29 03:22:51 EST 2025
Tue Nov 18 20:15:40 EST 2025
Tue Nov 25 14:44:27 EST 2025
IsPeerReviewed true
IsScholarly true
Issue 12
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c291t-e18c52944e263872f79d8cd31ac0f73ae30bcb64a05a84dd2cea99bf8a7f0f933
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0002-1363-7022
0000-0003-0881-3594
0000-0001-9766-9277
0000-0001-5286-7958
PQID 2748564104
PQPubID 2040496
PageCount 1
ParticipantIDs proquest_journals_2748564104
ieee_primary_9878164
crossref_citationtrail_10_1109_LWC_2022_3204656
crossref_primary_10_1109_LWC_2022_3204656
PublicationCentury 2000
PublicationDate 2022-12-01
PublicationDateYYYYMMDD 2022-12-01
PublicationDate_xml – month: 12
  year: 2022
  text: 2022-12-01
  day: 01
PublicationDecade 2020
PublicationPlace Piscataway
PublicationPlace_xml – name: Piscataway
PublicationTitle IEEE wireless communications letters
PublicationTitleAbbrev LWC
PublicationYear 2022
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref13
ref12
ref15
ref14
ref11
ref10
ref21
zhang (ref20) 2004
ref2
ref1
ref17
ref16
zhang (ref7) 2021
ref19
ref18
ref8
ref9
ref4
ref3
ref6
ref5
References_xml – ident: ref14
  doi: 10.1109/LCOMM.2021.3110714
– ident: ref18
  doi: 10.1109/TWC.2020.3002891
– ident: ref2
  doi: 10.1109/COMST.2017.2745201
– year: 2004
  ident: ref20
  publication-title: Matrix Analysis and Applications
– ident: ref21
  doi: 10.1137/1.9780898718829
– ident: ref11
  doi: 10.1109/LWC.2022.3193868
– ident: ref16
  doi: 10.1109/JPROC.2018.2867029
– ident: ref8
  doi: 10.1109/LCOMM.2022.3159525
– ident: ref5
  doi: 10.1109/JSAC.2020.3007035
– ident: ref15
  doi: 10.1109/TCOMM.2016.2599530
– ident: ref4
  doi: 10.1109/TCOMM.2021.3051897
– year: 2021
  ident: ref7
  article-title: Active RIS vs. passive RIS: Which will prevail in 6G?
  publication-title: arXiv 2103 15154
– ident: ref19
  doi: 10.1109/TSP.2011.2147784
– ident: ref17
  doi: 10.1017/CBO9780511804441
– ident: ref3
  doi: 10.1109/MWC.001.2100142
– ident: ref6
  doi: 10.1109/LWC.2020.3040607
– ident: ref9
  doi: 10.1109/LWC.2021.3111044
– ident: ref1
  doi: 10.1109/JIOT.2016.2579198
– ident: ref12
  doi: 10.1109/TWC.2021.3064024
– ident: ref10
  doi: 10.1109/TWC.2022.3206332
– ident: ref13
  doi: 10.1109/TVT.2021.3135498
SSID ssj0000601218
Score 2.4972563
Snippet This letter investigates an active reconfigurable intelligent surface (RIS)-aided mobile edge computing (MEC) system. Compared with passive RIS, the active RIS...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 1
SubjectTerms active RIS
Array signal processing
Computational modeling
Edge computing
Internet of things
latency minimization
Mobile computing
Mobile edge computing (MEC)
Optimized production technology
Performance gain
reconfigurable intelligent surface (RIS)
Reconfigurable intelligent surfaces
Resource management
Servers
Task analysis
Title Active Reconfigurable Intelligent Surface for Mobile Edge Computing
URI https://ieeexplore.ieee.org/document/9878164
https://www.proquest.com/docview/2748564104
Volume 11
WOSCitedRecordID wos000901617600004&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVIEE
  databaseName: IEEE Electronic Library (IEL)
  customDbUrl:
  eissn: 2162-2345
  dateEnd: 99991231
  omitProxy: false
  ssIdentifier: ssj0000601218
  issn: 2162-2337
  databaseCode: RIE
  dateStart: 20120101
  isFulltext: true
  titleUrlDefault: https://ieeexplore.ieee.org/
  providerName: IEEE
link http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3PS8MwFH5sw4Me_DXF6ZQcvAhmS5O2aY5jTBR0CCruVtI0GQPpZGv9-03ariiK4K2Hl1C-JC_ve0neB3ApAkM0CxKc2tgV-x71cJIyhv1EyNBGJB4lldgEn06j2Uw8tuC6eQujtS4vn-mB-yzP8tOlKlyqbGj5cWTD-za0OefVW60mn-LqitAynUe9kGLKGN-cShIxvH8dWy5I6YBR4iqEfduFSlmVH7643GBu9v73a_uwWweSaFSN_AG0dHYIO1_KC3ZhPCqdGXIUMzOLebFy76TQXVOFM0dPxcpIpZENXdHDMrEuAk3SuUaV2IPt5QhebibP41tciyZgRYWXY-1FKqDC9zW1S4tTw4UTKGKeVMRwJjUjiUpCX5JARn6aUqWlEImJJDfECMaOoZMtM30CSDHNLKHixhr7ngwji7FME2p0wG3UFvVguAExVnVFcSds8RaXzIKI2MIeO9jjGvYeXDUt3qtqGn_Ydh3MjV2NcA_6m3GK6-W2ji21joLQt9Ty9PdWZ7Dt-q7uofShk68KfQ5b6iNfrFcX5Uz6BCqHw-c
linkProvider IEEE
linkToHtml http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1bS8MwFD7MC6gP3sV5zYMvgt1y6yWPY0wcbkNw4t5KmiZjIJtsnb_fpO2Kogi-9eGkLV-Sk_MlOd8BuBG-wZr5iZfa2NXjhBIvSRnzeCJkYCMSQnFRbCIcDKLRSDzV4K7KhdFa55fPdMM95mf56Uwt3VZZ0_LjyIb3a7Dhc05Jka1V7ag4ZRGab-hRElCPMhauziWxaPZe25YNUtpgFDuNsG_rUF5Y5Yc3zpeY-73__dw-7JahJGoVfX8ANT09hJ0vAoNH0G7l7gw5kjk1k_Fy7jKlULfS4czQ83JupNLIBq-oP0usk0CddKxRUe7BvuUYXu47w_aDV5ZN8BQVJPM0iZRPBeea2skVUhMKV6KIEamwCZnUDCcqCbjEvox4mlKlpRCJiWRosBGMncD6dDbVp4AU08xSqtBYY05kEFmMZZpQo_3Qxm1RHZorEGNVaoq70hZvcc4tsIgt7LGDPS5hr8Nt1eK90NP4w_bIwVzZlQjX4WLVT3E54RaxJdeRH3BLLs9-b3UNWw_Dfi_udQeP57DtvlPcSrmA9Wy-1JewqT6yyWJ-lY-qT4e5xy4
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Active+Reconfigurable+Intelligent+Surface+for+Mobile+Edge+Computing&rft.jtitle=IEEE+wireless+communications+letters&rft.au=Peng%2C+Zhangjie&rft.au=Weng%2C+Ruisong&rft.au=Zhang%2C+Zhenkun&rft.au=Pan%2C+Cunhua&rft.date=2022-12-01&rft.issn=2162-2337&rft.eissn=2162-2345&rft.volume=11&rft.issue=12&rft.spage=2482&rft.epage=2486&rft_id=info:doi/10.1109%2FLWC.2022.3204656&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_LWC_2022_3204656
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2162-2337&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2162-2337&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2162-2337&client=summon