Active Reconfigurable Intelligent Surface for Mobile Edge Computing

This letter investigates an active reconfigurable intelligent surface (RIS)-aided mobile edge computing (MEC) system. Compared with passive RIS, the active RIS is equipped with active reflective amplifier, which can effectively circumvent the “double path loss” attenuation. We propose a joint comput...

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Veröffentlicht in:IEEE wireless communications letters Jg. 11; H. 12; S. 1
Hauptverfasser: Peng, Zhangjie, Weng, Ruisong, Zhang, Zhenkun, Pan, Cunhua, Wang, Jiangzhou
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Piscataway IEEE 01.12.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Schlagworte:
active RIS
Array signal processing
Computational modeling
Edge computing
Internet of things
latency minimization
Mobile computing
Mobile edge computing (MEC)
Optimized production technology
Performance gain
reconfigurable intelligent surface (RIS)
Reconfigurable intelligent surfaces
Resource management
Servers
Task analysis
ISSN:2162-2337, 2162-2345
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Zusammenfassung:This letter investigates an active reconfigurable intelligent surface (RIS)-aided mobile edge computing (MEC) system. Compared with passive RIS, the active RIS is equipped with active reflective amplifier, which can effectively circumvent the “double path loss” attenuation. We propose a joint computing and communication design to minimize the maximum computational latency (MCL), subject to both the phase shift constraints and the edge computing capability constraints. Specifically, the original problem is decoupled into four subproblems, and then the block coordinate descent (BCD) method and the successive convex approximation (SCA) method are applied to alternately optimize the subproblems. The simulation results show that with the same power budget, the performance gain achieved by the active RIS is much larger than that by the passive RIS.
Bibliographie:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:2162-2337
2162-2345
DOI:10.1109/LWC.2022.3204656