Active 3-D Thermography Based on Feature-Free Registration of Thermogram Sequence and 3-D Shape Via a Single Thermal Camera

Active three-dimensional(3-D) thermography combines 3-D shape and active thermography. Thus, it enables the provision of the intuitive thermographic inspection results for composite parts with a complex geometry. However, conventional 3-D thermography acquires thermographic information and 3-D shape...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on industrial electronics (1982) Jg. 69; H. 11; S. 11774 - 11784
Hauptverfasser: Deng, Baoyuan, Wu, Wentao, Li, Xiang, Wang, Hongjin, He, Yunze, Shen, Guoji, Tang, Yongpeng, Zhou, Ke, Zhang, Zhenjun, Wang, Yaonan
Format: Journal Article
Sprache:Englisch
Veröffentlicht: New York IEEE 01.11.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Schlagworte:
ISSN:0278-0046, 1557-9948
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Abstract Active three-dimensional(3-D) thermography combines 3-D shape and active thermography. Thus, it enables the provision of the intuitive thermographic inspection results for composite parts with a complex geometry. However, conventional 3-D thermography acquires thermographic information and 3-D shape through at least two independent sensors and requires complex cross-modal image registration algorithm based on the keypoint detection and matching. In this article, an active 3-D thermography system is proposed using only one thermal camera for moving objects. This system does not require an independent 3-D sensor while the thermal camera acts as the 3-D sensor. Nature behind that is that a mathematical model is proposed to unify the line scanning thermography and laser triangulation in the dynamic scanning process, taking a line laser as both heat excitation for active thermography and spatial coding for 3-D reconstruction. Furthermore, the model enables the feature-free registration of thermogram sequence and 3-D shape, so that the registration is fast and robust without keypoint features. The experiments on standard height specimens, 3-D printing glass fiber composites, and carbon fiber intake tube have shown the error is calibrated within 0.25 mm in the range of 1 to 150 mm and evidenced the capability for subsurface defects detection. The ease and robustness of the proposed active 3-D thermography have a bright future for 3-D measurement, defects detection, and quality control in the production line.
AbstractList Active three-dimensional(3-D) thermography combines 3-D shape and active thermography. Thus, it enables the provision of the intuitive thermographic inspection results for composite parts with a complex geometry. However, conventional 3-D thermography acquires thermographic information and 3-D shape through at least two independent sensors and requires complex cross-modal image registration algorithm based on the keypoint detection and matching. In this article, an active 3-D thermography system is proposed using only one thermal camera for moving objects. This system does not require an independent 3-D sensor while the thermal camera acts as the 3-D sensor. Nature behind that is that a mathematical model is proposed to unify the line scanning thermography and laser triangulation in the dynamic scanning process, taking a line laser as both heat excitation for active thermography and spatial coding for 3-D reconstruction. Furthermore, the model enables the feature-free registration of thermogram sequence and 3-D shape, so that the registration is fast and robust without keypoint features. The experiments on standard height specimens, 3-D printing glass fiber composites, and carbon fiber intake tube have shown the error is calibrated within 0.25 mm in the range of 1 to 150 mm and evidenced the capability for subsurface defects detection. The ease and robustness of the proposed active 3-D thermography have a bright future for 3-D measurement, defects detection, and quality control in the production line.
Author Wang, Hongjin
Zhou, Ke
Tang, Yongpeng
Zhang, Zhenjun
Shen, Guoji
Wang, Yaonan
Li, Xiang
Wu, Wentao
He, Yunze
Deng, Baoyuan
Author_xml – sequence: 1
  givenname: Baoyuan
  orcidid: 0000-0002-7446-8787
  surname: Deng
  fullname: Deng, Baoyuan
  email: dengbaoyuan@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 2
  givenname: Wentao
  surname: Wu
  fullname: Wu, Wentao
  email: wentaowu@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 3
  givenname: Xiang
  surname: Li
  fullname: Li, Xiang
  email: lixiang525447780@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 4
  givenname: Hongjin
  surname: Wang
  fullname: Wang, Hongjin
  email: hjwang_2018@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 5
  givenname: Yunze
  surname: He
  fullname: He, Yunze
  email: yhe@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 6
  givenname: Guoji
  surname: Shen
  fullname: Shen, Guoji
  email: shen.guoji@nudt.edu.cn
  organization: College of Mechatronic Engineering and Automation, National University of Defense Technology, Changsha, China
– sequence: 7
  givenname: Yongpeng
  surname: Tang
  fullname: Tang, Yongpeng
  email: bylh_ieee@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 8
  givenname: Ke
  surname: Zhou
  fullname: Zhou, Ke
  email: zhoukk00@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 9
  givenname: Zhenjun
  orcidid: 0000-0003-3087-8239
  surname: Zhang
  fullname: Zhang, Zhenjun
  email: zhenjun@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
– sequence: 10
  givenname: Yaonan
  orcidid: 0000-0002-0519-6458
  surname: Wang
  fullname: Wang, Yaonan
  email: yaonan@hnu.edu.cn
  organization: College of Electrical and Information Engineering, Hunan University, Changsha, China
BookMark eNp9kMFPwjAUhxujiYDeTbw08Tx87dZuPSKCkpCYCHpduu4VSmDDbpgQ_3kHI5p48PQO7_f93svXJedFWSAhNwz6jIG6n09GfQ6c9UPGIYrZGekwIeJAqSg5Jx3gcRIARPKSdKtqBcAiwUSHfA1M7T6RhsEjnS_Rb8qF19vlnj7oCnNaFnSMut55DMYekb7iwlW117VrNqX9RTZ0hh87LAxSXeTHutlSb5G-O001nbliscY2rtd0qDfo9RW5sHpd4fVp9sjbeDQfPgfTl6fJcDANDFesDrQFE4VgE5uZUIssUVYazDMwFqW1hidSZYrFhkEWMa5NKLmEXICwobG5Cnvkru3d-rL5sarTVbnzRXMy5TKOIBYSoElBmzK-rCqPNt16t9F-nzJID4rTRnF6UJyeFDeI_IMYVx_dNIrc-j_wtgUdIv7cUSIRnIvwG4NaimM
CODEN ITIED6
CitedBy_id crossref_primary_10_1002_adma_202415604
crossref_primary_10_1109_TIE_2023_3239862
crossref_primary_10_1080_10589759_2025_2466813
crossref_primary_10_1016_j_measurement_2025_116774
crossref_primary_10_1109_TIE_2023_3265034
crossref_primary_10_1080_10589759_2024_2438349
crossref_primary_10_3390_s24123793
crossref_primary_10_1080_10589759_2025_2496802
crossref_primary_10_1016_j_measurement_2024_114639
crossref_primary_10_1016_j_infrared_2023_104993
crossref_primary_10_1080_10589759_2025_2454349
crossref_primary_10_1109_TIM_2024_3406828
crossref_primary_10_1080_10589759_2024_2417260
crossref_primary_10_1016_j_measurement_2025_117730
crossref_primary_10_1016_j_optlaseng_2025_108884
crossref_primary_10_1109_TIM_2025_3545520
crossref_primary_10_1080_09500340_2025_2529516
crossref_primary_10_1080_10589759_2024_2387297
Cites_doi 10.1016/j.infrared.2019.01.026
10.1016/j.infrared.2021.103754
10.1016/j.compscitech.2020.108111
10.1364/OE.26.008179
10.1109/JSEN.2020.3043282
10.1109/TII.2018.2888519
10.1007/978-1-56990-816-7_17
10.1016/j.compstruct.2018.10.038
10.1364/AO.57.00D123
10.21611/qirt.2018.080
10.1109/ICRA.2013.6630890
10.21611/qirt.2018.074
10.1080/17686733.2012.714967
10.1117/12.2560268
10.1109/TIA.2011.2155019
10.1007/s10921-017-0412-x
10.1016/j.optlaseng.2019.05.009
10.1109/TII.2018.2836363
10.1016/j.ndteint.2018.05.011
10.1016/j.compstruct.2018.10.113
10.1007/s12567-017-0167-3
10.1109/SAS.2018.8336740
10.1016/j.ndteint.2004.03.002
10.1109/ISMAR.2011.6092378
10.1109/JSEN.2019.2941077
10.1109/JSEN.2019.2911699
10.1080/17686733.2019.1589824
10.1109/34.888718
10.1088/0957-0233/27/12/124006
10.1016/j.ndteint.2019.03.003
10.21152/1750-9548.13.1.85
10.1016/j.infrared.2019.103141
10.1109/JSEN.2020.3034460
10.1007/s40684-020-00192-9
10.1016/j.optlaseng.2020.106039
10.21611/qirt.2014.035
10.3390/s141120041
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
DOI 10.1109/TIE.2021.3120471
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005–Present
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList Technology Research Database

Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1557-9948
EndPage 11784
ExternalDocumentID 10_1109_TIE_2021_3120471
9585225
Genre orig-research
GrantInformation_xml – fundername: National University of Defense Technology
  grantid: 6142003200205
  funderid: 10.13039/501100007085
– fundername: National Natural Science Foundation of China; National Nature Science Foundation of China
  grantid: 61901167; 61811530331
  funderid: 10.13039/501100001809
– fundername: Royal Society Newton Mobility
  grantid: IEC\NSFC\170387
– fundername: Laboratory of Science and Technology on Integrated Logistics Support
– fundername: Natural Science Foundation of Hunan Province
  grantid: 2018RS3039
  funderid: 10.13039/501100004735
– fundername: China Hunan Provincial Science and Technology
  grantid: S2021GCZDYF0800
GroupedDBID -~X
.DC
0R~
29I
4.4
5GY
5VS
6IK
97E
9M8
AAJGR
AARMG
AASAJ
AAWTH
ABAZT
ABQJQ
ABVLG
ACGFO
ACGFS
ACIWK
ACKIV
ACNCT
AENEX
AETIX
AGQYO
AGSQL
AHBIQ
AI.
AIBXA
AKJIK
AKQYR
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ASUFR
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
HZ~
H~9
IBMZZ
ICLAB
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
MS~
O9-
OCL
P2P
RIA
RIE
RNS
TAE
TN5
TWZ
VH1
VJK
AAYXX
CITATION
7SP
8FD
L7M
ID FETCH-LOGICAL-c291t-af0c430f8fbc3a5b89f6cedb0cfe6ffc2869b917c10b412ac36260d505f3cfd93
IEDL.DBID RIE
ISICitedReferencesCount 23
ISICitedReferencesURI http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=000808129100098&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
ISSN 0278-0046
IngestDate Mon Jun 30 10:17:17 EDT 2025
Sat Nov 29 01:31:53 EST 2025
Tue Nov 18 22:32:50 EST 2025
Wed Aug 27 02:24:31 EDT 2025
IsPeerReviewed true
IsScholarly true
Issue 11
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c291t-af0c430f8fbc3a5b89f6cedb0cfe6ffc2869b917c10b412ac36260d505f3cfd93
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0002-0519-6458
0000-0002-7446-8787
0000-0003-3087-8239
PQID 2674075600
PQPubID 85464
PageCount 11
ParticipantIDs crossref_primary_10_1109_TIE_2021_3120471
crossref_citationtrail_10_1109_TIE_2021_3120471
ieee_primary_9585225
proquest_journals_2674075600
PublicationCentury 2000
PublicationDate 2022-11-01
PublicationDateYYYYMMDD 2022-11-01
PublicationDate_xml – month: 11
  year: 2022
  text: 2022-11-01
  day: 01
PublicationDecade 2020
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE transactions on industrial electronics (1982)
PublicationTitleAbbrev TIE
PublicationYear 2022
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref13
ref35
ref12
ref34
ref15
ref37
ref14
ref36
ref30
ref11
ref33
ref10
ref32
ref2
ref1
ref17
ref39
ref16
ref38
ref19
ref18
(ref31) 2018
ref24
ref23
ref26
ref25
ref20
Jang (ref5) 2018; 22
ref22
ref21
ref28
ref27
ref29
ref8
ref7
ref9
ref4
ref3
ref6
References_xml – ident: ref21
  doi: 10.1016/j.infrared.2019.01.026
– ident: ref1
  doi: 10.1016/j.infrared.2021.103754
– ident: ref19
  doi: 10.1016/j.compscitech.2020.108111
– volume: 22
  start-page: 201
  issue: 2
  year: 2018
  ident: ref5
  article-title: Multiple crack evaluation on concrete using a line laser thermography scanning system
  publication-title: Smart Struct. Syst
– ident: ref25
  doi: 10.1364/OE.26.008179
– ident: ref2
  doi: 10.1109/JSEN.2020.3043282
– ident: ref38
  doi: 10.1109/TII.2018.2888519
– ident: ref30
  doi: 10.1007/978-1-56990-816-7_17
– ident: ref10
  doi: 10.1016/j.compstruct.2018.10.038
– ident: ref15
  doi: 10.1364/AO.57.00D123
– ident: ref14
  doi: 10.21611/qirt.2018.080
– ident: ref28
  doi: 10.1109/ICRA.2013.6630890
– ident: ref23
  doi: 10.21611/qirt.2018.074
– ident: ref7
  doi: 10.1080/17686733.2012.714967
– ident: ref3
  doi: 10.1117/12.2560268
– ident: ref37
  doi: 10.1109/TIA.2011.2155019
– ident: ref17
  doi: 10.1007/s10921-017-0412-x
– ident: ref26
  doi: 10.1016/j.optlaseng.2019.05.009
– ident: ref18
  doi: 10.1109/TII.2018.2836363
– ident: ref6
  doi: 10.1016/j.ndteint.2018.05.011
– ident: ref13
  doi: 10.1016/j.compstruct.2018.10.113
– ident: ref39
  doi: 10.1007/s12567-017-0167-3
– ident: ref27
  doi: 10.1109/SAS.2018.8336740
– ident: ref22
  doi: 10.1016/j.ndteint.2004.03.002
– ident: ref29
  doi: 10.1109/ISMAR.2011.6092378
– ident: ref16
  doi: 10.1109/JSEN.2019.2941077
– ident: ref20
  doi: 10.1109/JSEN.2019.2911699
– ident: ref11
  doi: 10.1080/17686733.2019.1589824
– ident: ref34
  doi: 10.1109/34.888718
– ident: ref24
  doi: 10.1088/0957-0233/27/12/124006
– ident: ref4
  doi: 10.1016/j.ndteint.2019.03.003
– ident: ref9
  doi: 10.21152/1750-9548.13.1.85
– ident: ref8
  doi: 10.1016/j.infrared.2019.103141
– ident: ref33
  doi: 10.1109/JSEN.2020.3034460
– ident: ref12
  doi: 10.1007/s40684-020-00192-9
– year: 2018
  ident: ref31
  article-title: Dimensions series of rod and piston dynamic seals for hydraulic cylinders - Part 2: Dimensions and tolerances of bearing rings
– ident: ref32
  doi: 10.1016/j.optlaseng.2020.106039
– ident: ref35
  doi: 10.21611/qirt.2014.035
– ident: ref36
  doi: 10.3390/s141120041
SSID ssj0014515
Score 2.5092916
Snippet Active three-dimensional(3-D) thermography combines 3-D shape and active thermography. Thus, it enables the provision of the intuitive thermographic inspection...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 11774
SubjectTerms active thermography
Algorithms
Cameras
Carbon fibers
defect inspection
Defects
Fiber composites
Glass fibers
Image reconstruction
Image registration
Inspection
Laser modes
laser profiler
laser thermography
line scanning thermography (LST)
Mathematical models
Measurement by laser beam
Moving object recognition
Quality control
Registration
Robustness (mathematics)
Scanning
Shape
Solid modeling
Thermography
Three dimensional composites
Three dimensional printing
Three-dimensional (3-D) thermography
Three-dimensional displays
Triangulation
Title Active 3-D Thermography Based on Feature-Free Registration of Thermogram Sequence and 3-D Shape Via a Single Thermal Camera
URI https://ieeexplore.ieee.org/document/9585225
https://www.proquest.com/docview/2674075600
Volume 69
WOSCitedRecordID wos000808129100098&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVIEE
  databaseName: IEEE Electronic Library (IEL)
  customDbUrl:
  eissn: 1557-9948
  dateEnd: 99991231
  omitProxy: false
  ssIdentifier: ssj0014515
  issn: 0278-0046
  databaseCode: RIE
  dateStart: 19820101
  isFulltext: true
  titleUrlDefault: https://ieeexplore.ieee.org/
  providerName: IEEE
link http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1Nb9QwEB21VQ9wKP0AdaGtfOCChNnE8Sb2sbRdwaVCbIt6i5zJDK3UZqt0lwt_HtvJBhAVUm9RZCdWnuN54_G8AXibGYOMXEkzMU5qVFpWpArJOVNlDXubwbHYRHF-bq6u7Jc1eD_kwhBRPHxGH8JljOXXc1yGrbKx9dzWz791WC-KvMvVGiIGetJVK1BBMdY7fauQZGLHF5_PvCOoUu-fqkQX6V8mKNZU-WchjtZl-uJp49qGrZ5FiuMO9h1Yo2YXnv-hLbgHP4_jSiYyeSr8XGjvem1q8dHbrVrMGxHY37IlOW2JxFf6Pkjoijn_7nInZv1pa-GaOj5udu3uSXy7ccKJmX_ZLXXN_YhOXNjkegmX07OLk0-yr7QgUdl0IR0nqLOEDVeYuUllLOdIdZUgU86MyuS28o4dpkmlU-UwiNgktWdPnCHXNnsFG828oX0Q2nMIQjfxNIxCWWNHpMmgZn87aK-OYLz6-CX2MuShGsZtGd2RxJYerjLAVfZwjeDd0OO-k-D4T9u9AM_QrkdmBAcrfMv-H30oVV54bzYwvteP93oDz1RIdoiZhwewsWiXdAib-GNx89Aexen3Cybb16A
linkProvider IEEE
linkToHtml http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3BbtQwEB2VggQcoNAitrTgAxckzDqOk7WPpXTVinaF2AX1FjnOTFupzVbpLhd-vraTDSAqJG5RZCdWnuN54_G8AXibau3IUcl1pi1XTipeohxxyglLo8nbDIrFJkaTiT49NV_W4H2fC4OI8fAZfgiXMZZfzd0ybJUNjee2fv7dg_uZUlK02Vp9zEBlbb0CGTRjvdu3CkoKM5wdHXhXUCbeQ5VCjZI_jFCsqvLXUhzty_jp_41sA550PJLttcA_gzWsn8Pj39QFN-HnXlzLWMo_MT8bmqtOnZp99JarYvOaBf63bJCPG0T2Fc96EV02p19drti0O2_NbF3Fx03P7TWy7xeWWTb1L7vEtrkf0b4N21xb8G18MNs_5F2tBe6kSRbcknAqFaSpdKnNSm0od1iVwhHmRE7q3JTetXOJKFUirQsyNqLy_IlSR5VJX8B6Pa_xJTDlWQQ6m3kihqGwsUVUqJ0ifzuorw5guPr4heuEyEM9jMsiOiTCFB6uIsBVdHAN4F3f47oV4fhH280AT9-uQ2YAOyt8i-4vvSlkPvL-bOB823f3egMPD2cnx8Xx0eTzK3gkQ-pDzEPcgfVFs8RdeOB-LC5umtdxKt4Chu3a5w
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Active+3-D+Thermography+Based+on+Feature-Free+Registration+of+Thermogram+Sequence+and+3-D+Shape+Via+a+Single+Thermal+Camera&rft.jtitle=IEEE+transactions+on+industrial+electronics+%281982%29&rft.au=Deng%2C+Baoyuan&rft.au=Wu%2C+Wentao&rft.au=Li%2C+Xiang&rft.au=Wang%2C+Hongjin&rft.date=2022-11-01&rft.issn=0278-0046&rft.eissn=1557-9948&rft.volume=69&rft.issue=11&rft.spage=11774&rft.epage=11784&rft_id=info:doi/10.1109%2FTIE.2021.3120471&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_TIE_2021_3120471
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0278-0046&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0278-0046&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0278-0046&client=summon