6G communications through sub-Terahertz CMOS power amplifiers: Design challenges and trends
The fifth-generation (5G) network faces limitations in supporting emerging applications, such as artificial intelligence (AI), virtual reality (VR) and digital twins. To overcome these confines, sub-Terahertz (sub-THz) and Terahertz (THz) technologies are considered to be key enablers of effective 6...
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| Vydáno v: | Heliyon Ročník 11; číslo 10; s. e43393 |
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| Hlavní autoři: | , , , , , , , |
| Médium: | Journal Article |
| Jazyk: | angličtina |
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Elsevier Ltd
01.05.2025
Elsevier |
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| ISSN: | 2405-8440, 2405-8440 |
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| Abstract | The fifth-generation (5G) network faces limitations in supporting emerging applications, such as artificial intelligence (AI), virtual reality (VR) and digital twins. To overcome these confines, sub-Terahertz (sub-THz) and Terahertz (THz) technologies are considered to be key enablers of effective 6G wireless communications, offering higher transmission speeds, longer range and wider bandwidth. Achieving these capabilities requires careful engineering of 6G transceivers, with a focus on efficient power amplifiers (PAs) in the front-end, which play a critical role in effectively amplifying and transmitting signals over long distances. Complimentary metal-oxide-semiconductor (CMOS) technology-based PA in sub-THz suffers severe parasitic and limited maximum frequency, however, this has eventually been solved by different design architectures and scaling down of CMOS technology to break through the frequency limitations. In this article, we reviewed the potentials and capabilities of CMOS technology for designing 6G hardware, identified the state-of-art PA designs in the sub-THz band and then examined as well as compared the designs to identify the suitable design strategies for better performance. The circuit optimisation techniques, such as coupled-line, passive gain boosting method, zero-degree power splitting, load-pull matching, diode and capacitor linearisation for better gain, saturated output power and power added efficiency, are considered for the PA design architectures at different sub-THz bands. Furthermore, these methods are summarised and discussed with their advantages and disadvantages in lieu with their performances. The PA design trends, challenges and future perspectives are also presented and discussed. Therefore, this comprehensive review article will serve as a comparative study and reference for future PA designs for radio frequency integrated circuits (RFIC). |
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| AbstractList | The fifth-generation (5G) network faces limitations in supporting emerging applications, such as artificial intelligence (AI), virtual reality (VR) and digital twins. To overcome these confines, sub-Terahertz (sub-THz) and Terahertz (THz) technologies are considered to be key enablers of effective 6G wireless communications, offering higher transmission speeds, longer range and wider bandwidth. Achieving these capabilities requires careful engineering of 6G transceivers, with a focus on efficient power amplifiers (PAs) in the front-end, which play a critical role in effectively amplifying and transmitting signals over long distances. Complimentary metal-oxide-semiconductor (CMOS) technology-based PA in sub-THz suffers severe parasitic and limited maximum frequency, however, this has eventually been solved by different design architectures and scaling down of CMOS technology to break through the frequency limitations. In this article, we reviewed the potentials and capabilities of CMOS technology for designing 6G hardware, identified the state-of-art PA designs in the sub-THz band and then examined as well as compared the designs to identify the suitable design strategies for better performance. The circuit optimisation techniques, such as coupled-line, passive gain boosting method, zero-degree power splitting, load-pull matching, diode and capacitor linearisation for better gain, saturated output power and power added efficiency, are considered for the PA design architectures at different sub-THz bands. Furthermore, these methods are summarised and discussed with their advantages and disadvantages in lieu with their performances. The PA design trends, challenges and future perspectives are also presented and discussed. Therefore, this comprehensive review article will serve as a comparative study and reference for future PA designs for radio frequency integrated circuits (RFIC). |
| ArticleNumber | e43393 |
| Author | Lee, Jun Yan Guo, Xuanrui Miraz, Mahdi H. Tan, Jian Ding Wu, Duo Yew, Teh Jia Ng, Zi Neng Bhuiyan, Mohammad Arif Sobhan |
| Author_xml | – sequence: 1 givenname: Jun Yan surname: Lee fullname: Lee, Jun Yan organization: School of Artificial Intelligence and Robotics, Xiamen University Malaysia, Selangor, Malaysia – sequence: 2 givenname: Duo surname: Wu fullname: Wu, Duo organization: School of Artificial Intelligence and Robotics, Xiamen University Malaysia, Selangor, Malaysia – sequence: 3 givenname: Xuanrui surname: Guo fullname: Guo, Xuanrui organization: School of Artificial Intelligence and Robotics, Xiamen University Malaysia, Selangor, Malaysia – sequence: 4 givenname: Jian Ding surname: Tan fullname: Tan, Jian Ding email: jianding.tan@xmu.edu.my organization: School of Artificial Intelligence and Robotics, Xiamen University Malaysia, Selangor, Malaysia – sequence: 5 givenname: Teh Jia surname: Yew fullname: Yew, Teh Jia email: jiayew.teh@xmu.edu.my organization: School of Computing and Data Science, Xiamen University Malaysia, Selangor, Malaysia – sequence: 6 givenname: Zi Neng surname: Ng fullname: Ng, Zi Neng organization: School of Artificial Intelligence and Robotics, Xiamen University Malaysia, Selangor, Malaysia – sequence: 7 givenname: Mohammad Arif Sobhan surname: Bhuiyan fullname: Bhuiyan, Mohammad Arif Sobhan organization: School of Artificial Intelligence and Robotics, Xiamen University Malaysia, Selangor, Malaysia – sequence: 8 givenname: Mahdi H. orcidid: 0000-0002-6795-7048 surname: Miraz fullname: Miraz, Mahdi H. email: m.miraz@ieee.org organization: School of Computing and Data Science, Xiamen University Malaysia, Selangor, Malaysia |
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| Cites_doi | 10.1109/LMWC.2021.3049458 10.1109/JSSC.2021.3139359 10.1109/JSSC.2020.3018819 10.1007/s42341-024-00513-8 10.1109/LMWC.2019.2899487 10.1109/TMTT.2023.3322742 10.1109/ACCESS.2021.3096423 10.1109/TMTT.2014.2385777 10.1134/S2635167622010037 10.3390/s22093438 10.1109/MCOM.001.2000273 10.1109/LMWC.2019.2902333 10.1109/ACCESS.2020.2981745 10.1631/FITEE.1800070 10.1109/JMW.2020.3034648 10.1109/LMWC.2020.3046745 10.1186/s13673-020-00258-2 10.1109/JIOT.2021.3103320 10.1109/TMTT.2019.2936558 10.1109/LMWC.2016.2574834 10.1109/LMWT.2024.3380441 10.1109/TTHZ.2021.3128677 10.1109/ACCESS.2021.3080710 10.1109/TMTT.2019.2896047 10.1109/JSSC.2022.3145394 10.1016/j.aej.2021.09.051 10.1109/TMTT.2020.2986196 10.1109/LMWC.2019.2948763 10.1109/TMTT.2013.2288085 10.1109/LMWC.2021.3058101 10.1109/LMWC.2021.3139018 |
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| Copyright | 2025 The Authors |
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| Issue | 10 |
| Keywords | 6G CMOS Transmitter Front-end Power amplifier Transceiver Sub-THz |
| Language | English |
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