Spatiotemporal Measurement of Charge at Ceramic Substrate-Silicone Gel Interface in Medium-Voltage Power Modules

With the proliferation of high-voltage, high-power density devices, insulation failure has emerged as a latent hazard in power modules. Notably, breakdown along ceramic substrate-silicone gel interfaces is a typical insulation failure process in power modules, necessitating particular attention and...

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Vydáno v:IEEE transactions on power electronics Ročník 39; číslo 12; s. 15360 - 15375
Hlavní autoři: Li, Kaixuan, Zhang, Boya, Yang, Ziyue, Jiang, Xinyu, Yao, Minghan, Li, Xingwen
Médium: Journal Article
Jazyk:angličtina
Vydáno: IEEE 01.12.2024
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ISSN:0885-8993, 1941-0107
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Abstract With the proliferation of high-voltage, high-power density devices, insulation failure has emerged as a latent hazard in power modules. Notably, breakdown along ceramic substrate-silicone gel interfaces is a typical insulation failure process in power modules, necessitating particular attention and elucidation. Specifically, the charge movement characteristics that play a pivotal role in the failure process should be expounded. However, the lack of characterization methods currently renders these characteristics unclear. In this study, we proposed a method for the spatiotemporal measurement of the interfacial charge density between a direct-bonded copper ceramic and silicone gel. A reflective optical system was developed based on the Pockels effect to enable the measurement of nontransparent samples, such as encapsulation structures, in power modules. The measurement range of the optical system is ±20 kV. The interfacial charge density was calculated using an inversion algorithm. Charge dynamics at inaccessible interfaces were described for the first time. The threshold is ∼100 pC/mm 2 with 10- μ s temporal and 27- μ m spatial resolution. Compared with traditional methods, the proposed method stands out for its superior spatiotemporal dimensionality. Besides, it enables visual measurements, making it a solution for monitoring insulation status and diagnosing insulation defects specifically for encapsulation structures in power modules. The proposed method can help engineers improve the insulation design of power modules. This article is accompanied by a video demonstrating the dynamic process of discharge.
AbstractList With the proliferation of high-voltage, high-power density devices, insulation failure has emerged as a latent hazard in power modules. Notably, breakdown along ceramic substrate-silicone gel interfaces is a typical insulation failure process in power modules, necessitating particular attention and elucidation. Specifically, the charge movement characteristics that play a pivotal role in the failure process should be expounded. However, the lack of characterization methods currently renders these characteristics unclear. In this study, we proposed a method for the spatiotemporal measurement of the interfacial charge density between a direct-bonded copper ceramic and silicone gel. A reflective optical system was developed based on the Pockels effect to enable the measurement of nontransparent samples, such as encapsulation structures, in power modules. The measurement range of the optical system is ±20 kV. The interfacial charge density was calculated using an inversion algorithm. Charge dynamics at inaccessible interfaces were described for the first time. The threshold is ∼100 pC/mm 2 with 10- μ s temporal and 27- μ m spatial resolution. Compared with traditional methods, the proposed method stands out for its superior spatiotemporal dimensionality. Besides, it enables visual measurements, making it a solution for monitoring insulation status and diagnosing insulation defects specifically for encapsulation structures in power modules. The proposed method can help engineers improve the insulation design of power modules. This article is accompanied by a video demonstrating the dynamic process of discharge.
Author Zhang, Boya
Jiang, Xinyu
Li, Xingwen
Li, Kaixuan
Yao, Minghan
Yang, Ziyue
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Cites_doi 10.1109/jestpe.2020.2988847
10.1109/tdei.2020.009041
10.1088/1361-6463/acee0a
10.1364/JOSAB.9.001110
10.1109/TCPMT.2021.3106962
10.1088/0022-3727/29/11/024
10.1109/TDEI.2015.7116371
10.1088/1361-6595/ab3c27
10.1109/tdei.2022.3228759
10.1109/IAS.2005.1518425
10.1117/12.369375
10.1109/TDEI.2022.3225247
10.1049/hve2.12073
10.1109/TPEL.2019.2908656
10.1109/TDEI.2015.005411
10.1088/1361-6595/ac676e
10.1109/TPEL.2021.3112096
10.1109/TDEI.2013.6451366
10.1109/61.847221
10.1016/j.polymdegradstab.2022.110197
10.1088/1361-6463/aa5605
10.1109/TDEI.2015.005412
10.1109/ICHVE53725.2022.9961665
10.1109/TPEL.2021.3072655
10.1109/TPEL.2020.3014043
10.1109/TDEI.2006.1667740
10.1109/TPWRD.2013.2250315
10.1109/tpel.2013.2279997
10.1088/1361-6595/ac90e9
10.1109/WiPDAAsia51810.2021.9656032
10.1016/B978-012396561-5/50013-X
10.1063/5.0102975
10.1117/12.255348
10.1109/TIM.2017.2730981
10.1088/1361-6595/ac823c
10.1109/TPS.2022.3233030
10.1088/1361-6595/abefa7
10.1088/1361-6595/aadcc0
10.1109/JESTPE.2019.2951801
10.1109/tdei.2011.5739453
10.1109/TIE.2022.3225830
10.1109/ICEP.2016.7486885
10.1109/28.980373
10.1143/JJAP.30.1262
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References ref13
ref35
ref12
ref34
ref15
ref37
ref36
ref31
ref30
ref11
ref33
ref10
ref32
ref2
ref1
ref17
ref39
ref16
ref38
ref19
ref18
ref24
ref46
ref23
ref45
ref26
ref25
ref20
ref42
ref22
ref44
ref21
ref43
ref28
ref27
Mitic (ref14)
ref29
ref8
ref7
ref9
ref4
ref3
ref6
ref5
Iverson (ref41) 2004
ref40
References_xml – ident: ref1
  doi: 10.1109/jestpe.2020.2988847
– ident: ref5
  doi: 10.1109/tdei.2020.009041
– ident: ref24
  doi: 10.1088/1361-6463/acee0a
– ident: ref42
  doi: 10.1364/JOSAB.9.001110
– ident: ref13
  doi: 10.1109/TCPMT.2021.3106962
– ident: ref36
  doi: 10.1088/0022-3727/29/11/024
– ident: ref19
  doi: 10.1109/TDEI.2015.7116371
– ident: ref34
  doi: 10.1088/1361-6595/ab3c27
– ident: ref4
  doi: 10.1109/tdei.2022.3228759
– ident: ref16
  doi: 10.1109/IAS.2005.1518425
– ident: ref37
  doi: 10.1117/12.369375
– ident: ref6
  doi: 10.1109/TDEI.2022.3225247
– ident: ref25
  doi: 10.1049/hve2.12073
– ident: ref23
  doi: 10.1109/TPEL.2019.2908656
– ident: ref22
  doi: 10.1109/TDEI.2015.005411
– ident: ref30
  doi: 10.1088/1361-6595/ac676e
– ident: ref44
  doi: 10.1109/TPEL.2021.3112096
– ident: ref18
  doi: 10.1109/TDEI.2013.6451366
– ident: ref38
  doi: 10.1109/61.847221
– ident: ref3
  doi: 10.1016/j.polymdegradstab.2022.110197
– ident: ref29
  doi: 10.1088/1361-6463/aa5605
– ident: ref20
  doi: 10.1109/TDEI.2015.005412
– ident: ref12
  doi: 10.1109/ICHVE53725.2022.9961665
– ident: ref8
  doi: 10.1109/TPEL.2021.3072655
– ident: ref9
  doi: 10.1109/TPEL.2020.3014043
– ident: ref17
  doi: 10.1109/TDEI.2006.1667740
– ident: ref39
  doi: 10.1109/TPWRD.2013.2250315
– ident: ref2
  doi: 10.1109/tpel.2013.2279997
– start-page: 1453
  volume-title: Proc. IEEE Ind. Appl. Conf.
  ident: ref14
  article-title: Localization of electrical-insulation and partial-discharge failures of IGBT modules
– ident: ref27
  doi: 10.1088/1361-6595/ac90e9
– ident: ref11
  doi: 10.1109/WiPDAAsia51810.2021.9656032
– ident: ref40
  doi: 10.1016/B978-012396561-5/50013-X
– ident: ref31
  doi: 10.1063/5.0102975
– ident: ref43
  doi: 10.1117/12.255348
– ident: ref45
  doi: 10.1109/TIM.2017.2730981
– ident: ref32
  doi: 10.1088/1361-6595/ac823c
– year: 2004
  ident: ref41
  article-title: Electro-optic Pockels cell voltage sensors for accelerator diagnostics
– ident: ref46
  doi: 10.1109/TPS.2022.3233030
– ident: ref28
  doi: 10.1088/1361-6595/abefa7
– ident: ref33
  doi: 10.1088/1361-6595/aadcc0
– ident: ref21
  doi: 10.1109/JESTPE.2019.2951801
– ident: ref35
  doi: 10.1109/tdei.2011.5739453
– ident: ref10
  doi: 10.1109/TIE.2022.3225830
– ident: ref7
  doi: 10.1109/ICEP.2016.7486885
– ident: ref15
  doi: 10.1109/28.980373
– ident: ref26
  doi: 10.1143/JJAP.30.1262
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Snippet With the proliferation of high-voltage, high-power density devices, insulation failure has emerged as a latent hazard in power modules. Notably, breakdown...
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StartPage 15360
SubjectTerms Discharge detection method
Electric fields
Encapsulation
Insulation
interfacial charge kinetics
inversion algorithm
Kinetic theory
Medium voltage
medium-voltage module insulation status
Multichip modules
Optical polarization
Optical refraction
Optical variables control
Pockels effect
Spatiotemporal phenomena
Title Spatiotemporal Measurement of Charge at Ceramic Substrate-Silicone Gel Interface in Medium-Voltage Power Modules
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