Microstructure-based simulation of thermomechanical behavior of composite materials by object-oriented finite element analysis

While it is well recognized that microstructure controls the physical and mechanical properties of a material, the complexity of the microstructure often makes it difficult to simulate by analytical or numerical techniques. In this paper we present a relatively new approach to incorporate microstruc...

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Veröffentlicht in:	Materials characterization Jg. 49; H. 5; S. 395 - 407
Hauptverfasser:	Chawla, N., Patel, B.V., Koopman, M., Chawla, K.K., Saha, R., Patterson, B.R., Fuller, E.R., Langer, S.A.
Format:	Journal Article
Sprache:	Englisch
Veröffentlicht:	New York, NY Elsevier Inc 01.12.2002 Elsevier Science
Schlagworte:	Al/SiC composites Applied sciences Cross-disciplinary physics: materials science; rheology Exact sciences and technology Materials science Metals. Metallurgy Microstructure-based modeling Physics Specific materials Specific materials: fabrication, treatment, testing and analysis Thermal expansion WC/Co composites Young's modulus Al/SiC composites Young's modulus Thermal expansion Microstructure-based modeling WC/Co composites Aluminium base alloys Metal matrix composite Digital simulation Theoretical study Silicon carbides Thermomechanical properties Dispersion strengthened metal Finite element method Composite materials Imaging Object oriented Property structure relationship Microstructure
ISSN:	1044-5803, 1873-4189
Online-Zugang:	Volltext
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