Signal Integrity Analysis of Tapered Through Packaging Multibit Glass Vias Using Exponential Matrix-Rational Approximation Technique

In this article, we develop a wideband scalable analytical model of tapered through packaging differential multibit vias (TP-DMVs) with pads in glass interposer by developing an exponential matrix-rational approximation (EM-RA) technique. An electrical RLGC model, which also includes the skin effect...

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Vydané v:	IEEE transactions on components, packaging, and manufacturing technology (2011) Ročník 15; číslo 5; s. 1014 - 1024
Hlavní autori:	Kumar, Ajay, Dhiman, Rohit
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	Piscataway IEEE 01.05.2025 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Predmet:	Analytical models Approximation Aspect ratio Crosstalk Equivalent circuits exponential matrix-rational approximation (EM-RA) Glass Inductance Integrated circuit modeling Optical scattering Packaging Parameters Phonons Signal integrity signal integrity performance Skin effect Solid modeling Stability criteria Surface roughness taper effect Three-dimensional displays through package vias (TPVs)
ISSN:	2156-3950, 2156-3985
On-line prístup:	Získať plný text
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