APA (7th ed.) Citation

Kumar, A., & Dhiman, R. (2025). Signal Integrity Analysis of Tapered Through Packaging Multibit Glass Vias Using Exponential Matrix-Rational Approximation Technique. IEEE transactions on components, packaging, and manufacturing technology (2011), 15(5), 1014-1024. https://doi.org/10.1109/TCPMT.2025.3553362

Chicago Style (17th ed.) Citation

Kumar, Ajay, and Rohit Dhiman. "Signal Integrity Analysis of Tapered Through Packaging Multibit Glass Vias Using Exponential Matrix-Rational Approximation Technique." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011) 15, no. 5 (2025): 1014-1024. https://doi.org/10.1109/TCPMT.2025.3553362.

MLA (9th ed.) Citation

Kumar, Ajay, and Rohit Dhiman. "Signal Integrity Analysis of Tapered Through Packaging Multibit Glass Vias Using Exponential Matrix-Rational Approximation Technique." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011), vol. 15, no. 5, 2025, pp. 1014-1024, https://doi.org/10.1109/TCPMT.2025.3553362.