Business process analysis of university admissions: Combining TM Forum’s eTOM framework, discrete-event simulation, and queuing theory

The increasing complexity of university admissions requires efficient, standardized processes to manage large volumes of applications and changing regulatory requirements. To address this, the paper applies the TM Forum’s Business Process Framework (eTOM) from the telecommunications industry, a stan...

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Bibliographic Details
Published in:Discrete and continuous models and applied computational science Vol. 33; no. 2; pp. 157 - 171
Main Authors: Terentyev, Konstantin M., Abuzyarova, Leyla D., Kochetkova, Irina A., Samouylov, Konstantin E.
Format: Journal Article
Language:English
Published: Peoples’ Friendship University of Russia (RUDN University) 15.07.2025
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ISSN:2658-4670, 2658-7149
Online Access:Get full text
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Summary:The increasing complexity of university admissions requires efficient, standardized processes to manage large volumes of applications and changing regulatory requirements. To address this, the paper applies the TM Forum’s Business Process Framework (eTOM) from the telecommunications industry, a standard for modeling and optimizing academic admissions workflows. Using RUDN University as a case study, the entire admissions process is formalized into a hierarchical model that aligns with the eTOM level 2 processes. The approach integrates discrete-event simulation (DES) and queueing network analysis, providing detailed process modeling and analytical solutions for assessing the average execution time. DES replicates the dynamic interactions between applicants and staff. Queueing analysis provides mathematical model to analyze the average execution times for each step in the process. Together, these techniques help optimize the admissions process and ensure efficient management of large volumes of applications. Through this approach, we aim to streamline processes, increase transparency, and support digital transformation efforts within universities.
ISSN:2658-4670
2658-7149
DOI:10.22363/2658-4670-2025-33-2-157-171