Duffy, A., & Liu, E. (2024). Editorial: Introduction to the Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC. IEEE transactions on electromagnetic compatibility, 66(6), 1926-1927. https://doi.org/10.1109/TEMC.2024.3504693
Chicago Style (17th ed.) CitationDuffy, Alistair, and En-Xiao Liu. "Editorial: Introduction to the Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility 66, no. 6 (2024): 1926-1927. https://doi.org/10.1109/TEMC.2024.3504693.
MLA (9th ed.) CitationDuffy, Alistair, and En-Xiao Liu. "Editorial: Introduction to the Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 6, 2024, pp. 1926-1927, https://doi.org/10.1109/TEMC.2024.3504693.