Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC

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Vydáno v:IEEE transactions on electromagnetic compatibility Ročník 65; číslo 6; s. 2070 - 2071
Médium: Journal Article
Jazyk:angličtina
Vydáno: IEEE 01.12.2023
ISSN:0018-9375, 1558-187X
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