(2023). Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC. IEEE transactions on electromagnetic compatibility, 65(6), 2070-2071. https://doi.org/10.1109/TEMC.2023.3332183
Chicago Style (17th ed.) Citation"Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility 65, no. 6 (2023): 2070-2071. https://doi.org/10.1109/TEMC.2023.3332183.
MLA (9th ed.) Citation"Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 6, 2023, pp. 2070-2071, https://doi.org/10.1109/TEMC.2023.3332183.
Warning: These citations may not always be 100% accurate.