(2023). Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC. IEEE transactions on electromagnetic compatibility, 65(6), 2070-2071. https://doi.org/10.1109/TEMC.2023.3332183
Chicago-Zitierstil (17. Ausg.)"Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility 65, no. 6 (2023): 2070-2071. https://doi.org/10.1109/TEMC.2023.3332183.
MLA-Zitierstil (9. Ausg.)"Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 6, 2023, pp. 2070-2071, https://doi.org/10.1109/TEMC.2023.3332183.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.