(2023). Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC. IEEE transactions on electromagnetic compatibility, 65(6), 2070-2071. https://doi.org/10.1109/TEMC.2023.3332183
Citace podle Chicago (17th ed.)"Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility 65, no. 6 (2023): 2070-2071. https://doi.org/10.1109/TEMC.2023.3332183.
Citace podle MLA (9th ed.)"Call for Papers: Special Issue on AI, Machine Learning, and Deep Learning: Advances and Applications for EMC." IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 6, 2023, pp. 2070-2071, https://doi.org/10.1109/TEMC.2023.3332183.
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