Performance-impact limited area fill synthesis
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local layout density. To improve manufacturability and performance predictability, area fill features are inserted into the lay...
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| Published in: | 2003 40th Annual Conference Design Automation pp. 22 - 27 |
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| Main Authors: | , , |
| Format: | Conference Proceeding |
| Language: | English |
| Published: |
New York, NY, USA
ACM
02.06.2003
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| Series: | ACM Conferences |
| Subjects: | |
| ISBN: | 1581136889, 9781581136883 |
| Online Access: | Get full text |
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