Inversion for Thermal Properties with Frequency Domain Thermoreflectance

3D integration of multiple microelectronic devices improves size, weight, and power while increasing the number of interconnections between components. One integration method involves the use of metal bump bonds to connect devices and components on a common interposer platform. Significant variation...

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Vydané v:	ACS applied materials & interfaces Ročník 16; číslo 3; s. 4117
Hlavní autori:	Treweek, Benjamin, Akcelik, Volkan, Hodges, Wyatt, Jarzembski, Amun, Bahr, Matthew, Jordan, Matthew, McDonald, Anthony, Yates, Luke, Walsh, Timothy, Pickrell, Gregory
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	United States 24.01.2024
Predmet:	thermal boundary conductance finite element method heterogeneously integrated microelectronics gradient-based optimization GaN-diamond devices frequency-domain thermoreflectance
ISSN:	1944-8252, 1944-8252
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