Inversion for Thermal Properties with Frequency Domain Thermoreflectance

3D integration of multiple microelectronic devices improves size, weight, and power while increasing the number of interconnections between components. One integration method involves the use of metal bump bonds to connect devices and components on a common interposer platform. Significant variation...

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Bibliographic Details

Published in:	ACS applied materials & interfaces Vol. 16; no. 3; p. 4117
Main Authors:	Treweek, Benjamin, Akcelik, Volkan, Hodges, Wyatt, Jarzembski, Amun, Bahr, Matthew, Jordan, Matthew, McDonald, Anthony, Yates, Luke, Walsh, Timothy, Pickrell, Gregory
Format:	Journal Article
Language:	English
Published:	United States 24.01.2024
Subjects:	thermal boundary conductance finite element method heterogeneously integrated microelectronics gradient-based optimization GaN-diamond devices frequency-domain thermoreflectance
ISSN:	1944-8252, 1944-8252
Online Access:	Get more information
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