In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density

Electromigration (EM) poses significant challenges to the reliability of miniaturized devices, particularly three-dimensional integrated circuits (3DICs) operating under high current densities. The EM phenomenon results from atomic-scale mechanisms involving momentum transfer between electron carrie...

Full description

Bibliographic Details

Published in:	ACS nano Vol. 19; no. 33; pp. 30211 - 30220
Main Authors:	Huang, Hua-Jing, Wang, Chien-Hua, Wang, Che-Hung, Shen, Fang-Chun, Yang, Shih-Chi, Ong, Jia-Juen, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chen, Chih, Wu, Wen-Wei
Format:	Journal Article
Language:	English
Published:	United States American Chemical Society 26.08.2025
Subjects:	electromigration electroplated copper high-resolution TEM in situ HRTEM 3D IC
ISSN:	1936-0851, 1936-086X, 1936-086X
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!