In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density

Electromigration (EM) poses significant challenges to the reliability of miniaturized devices, particularly three-dimensional integrated circuits (3DICs) operating under high current densities. The EM phenomenon results from atomic-scale mechanisms involving momentum transfer between electron carrie...

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Vydané v:	ACS nano Ročník 19; číslo 33; s. 30211 - 30220
Hlavní autori:	Huang, Hua-Jing, Wang, Chien-Hua, Wang, Che-Hung, Shen, Fang-Chun, Yang, Shih-Chi, Ong, Jia-Juen, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chen, Chih, Wu, Wen-Wei
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	United States American Chemical Society 26.08.2025
Predmet:	electromigration electroplated copper high-resolution TEM in situ HRTEM 3D IC
ISSN:	1936-0851, 1936-086X, 1936-086X
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