APA (7th ed.) Citation

Huang, H., Wang, C., Wang, C., Shen, F., Yang, S., Ong, J., . . . Wu, W. (2025). In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density. ACS nano, 19(33), 30211-30220. https://doi.org/10.1021/acsnano.5c07534

Chicago Style (17th ed.) Citation

Huang, Hua-Jing, et al. "In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density." ACS Nano 19, no. 33 (2025): 30211-30220. https://doi.org/10.1021/acsnano.5c07534.

MLA (9th ed.) Citation

Huang, Hua-Jing, et al. "In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density." ACS Nano, vol. 19, no. 33, 2025, pp. 30211-30220, https://doi.org/10.1021/acsnano.5c07534.