Any-Angle Routing for Redistribution Layers in 2.5D IC Packages
Redistribution layers (RDLs) are widely applied for signal transmissions in advanced packages. Traditional redistribution layer (RDL) routers use only 90- and 135-degree turns for routing. With technological advances, routing in RDLs can be any obtuse angle, leading to larger routing solution spaces...
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| Published in: | 2023 60th ACM/IEEE Design Automation Conference (DAC) pp. 1 - 6 |
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| Main Authors: | , , |
| Format: | Conference Proceeding |
| Language: | English |
| Published: |
IEEE
09.07.2023
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| Subjects: | |
| Online Access: | Get full text |
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