APA (7th ed.) Citation

Chung, M., Chuang, J., & Chang, Y. (2023, July 9). Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. 2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6. https://doi.org/10.1109/DAC56929.2023.10247899

Chicago Style (17th ed.) Citation

Chung, Min-Hsuan, Je-Wei Chuang, and Yao-Wen Chang. "Any-Angle Routing for Redistribution Layers in 2.5D IC Packages." 2023 60th ACM/IEEE Design Automation Conference (DAC) 9 Jul. 2023: 1-6. https://doi.org/10.1109/DAC56929.2023.10247899.

MLA (9th ed.) Citation

Chung, Min-Hsuan, et al. "Any-Angle Routing for Redistribution Layers in 2.5D IC Packages." 2023 60th ACM/IEEE Design Automation Conference (DAC), 9 Jul. 2023, pp. 1-6, https://doi.org/10.1109/DAC56929.2023.10247899.